Post subject: General question on Packaging and circuit Board
Posted: Fri Oct 06, 2006 4:46 pm
Jun 30, 2006 9:56 am
Location: Blacksburg Virginia
I have an open and general question regarding
material such as Roger3000, LTCC or Ceramic..
I have heard people
complaning about those material at frequency above 30GHz, either for
the loss, for the unstable lateral dimensions or price.
has experience with those type of material for either packaging or circuit
and could give me more details.. What problems do people usually face
with those type of materials?
Is there a frequency at which there
is no solution for chip on package or it is to expensive(above $100/inch^2)??
or just to much twinking required???
I hope my question is not
to vague... and there is some kind of response...