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Sr. Engineering Manager Sought by IC Interconnect

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Sr. Engineering Manager

IC Interconnect is a leading supplier of flip chip wafer bumping, wafer level CSP and back-end services to the semiconductor and electronics communities. Our customers have world wide locations and are serviced from our manufacturing locations in Colorado Springs. We offer a company supported medical plan, paid holidays, vacation time, etc.

IC Interconnect is seeking an experienced engineer to do development and manufacturing support in a high tech, high volume, small company environment on processes to support advanced packaging of wafer and die level bare silicon products.

IC Interconnect Products - RF CafeMinimum Qualifications:

The minimum educational requirement is BSME or BSM. A proven track record with 10 years experience in electronic packaging, ISO/TS qualified manufacturing environment. You must have exceptional written and verbal communications skills, a strong working knowledge of PC’s, CAD, SPC and the Microsoft office suite. You must be self reliant and able to work as part of a team, with a dedication to exceed customer expectations.

Job Description:

This position is ideal for a hands-on, mechanically inclined individual experienced in semiconductor manufacturing process, die level test, tape and reel, surface mount package construction processes, wafer bumping, WLCSP, plastic packaging and SMT. In addition, this position will manage the manufacturing operations including process documentation, programming, SPC and troubleshooting. As a value added service provider we become an integral part of system reliability. Attention to detail is a must. This career choice offers a challenging and varied work environment. You will be a key player in the organization, shaping our success by ensuring the efficient operation of our current processes and developing new capabilities. In this small company you will have a major impact on the success of projects and the company as a whole. The scope of opportunities for new responsibilities are professional growth are not constrained as the might be in a larger organization. This position will include:

  • Design
    • CAD (AutoCAD, GDSII, Artworks, Gerber, Visio)
    • SPC (JMP, Minitab, SAS)
  • Development
    • Process development
    • Equipment adaptation for a wide variety of needs.
  • Manufacturing
    • Equipment programming, Process development and improvement, Cost reduction, Statistical process control, Equipment PM and Trouble shooting
  • Sales
    • Driving revenue growth by evaluation of potential new customer applications.

Work Site:

Colorado Springs, Colorado.

 

Travel:

Occasional travel to provide customer or sales support, conferences and trade shows is required.

 

Status:

Full time, exempt, must be able to support 24/7 operation.

 

Compensation:

The compensation structure of a base salary and a quarterly bonus based on company profitability provides security with a significant upside potential. In addition we offer:

  • A company supported medical and dental insurance plan
  • Company paid holidays, floating personal days, and vacation

Contact:

IC Interconnect
1025 Elkton Drive
Colorado Springs, CO  80907
USA
Email: icinterconnectCO@gmail.com
Website: www.icinterconnect.com

 

 

 

 

Posted  June 16, 2014

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