Applied Wave Research (AWR) - Press Release 9-10-2007
AWR Introduces AXIEM - Innovative New EM Technology That Transforms
Microwave/RF Electronic Product Design
AXIEM’s proprietary algorithms deliver speed, capacity, and accuracy
to designers of today’s electronic products, migrating EM analysis from
pure back-end post verification to upfront diagnostic design.
EL SEGUNDO, Calif. — Sept. 10, 2007 — Applied Wave Research, Inc.
(AWR®), the innovation leader in RF EDA, today announces AXIEM™ electromagnetic
(EM) design software, an innovative and unprecedented design tool that,
for the first time, delivers EM analysis as a true upfront design technology,
where it benefits designers most by helping to diagnose issues early,
thereby significantly shortening the design process. The AXIEM product
was developed specifically for three-dimensional (3D) planar applications
such as RF printed circuit boards (PCBs) and modules, low temperature
co-fired ceramic (LTCC), monolithic microwave integrated circuit (MMIC),
and RFIC designs, which are the heart of today’s electronic designs.
“Presently, every modern electronic product, wired and wireless,
requires some level of EM analysis,” said Joe Pekarek, AWR’s chief technology
officer and visionary of the new product. “Yet current EM solutions
have failed to provide for the demands of product designers who require
EM analysis as an efficient and accurate design diagnostic utility and
not just a pure back-end verification tool. This design need is exactly
why we pioneered AXIEM.”
The AXIEM technology is an open boundary,
non-gridded, method-of-moments (MoM) solver that supports true thick
metal in layered dielectric media. Furthermore, AXIEM leverages the
most recent advancements in EM solver and meshing algorithms, as well
as computer architecture, to deliver unprecedented speed and accuracy
of results that become even more pronounced as the design complexity
grows and the number of unknowns increases.
The solver algorithm within the AXIEM technology was expressly pioneered
to overcome limitations of existing 3D planar formulations that rely
on the Sommerfeld (or similar) integral for delivering speed of simulation
yet at the cost of accuracy and dynamic range. AXIEM’s solution methodology
is unique to AWR and a proprietary technique that is best-described
as similar to the fast multipole method, yet adapted for full-wave analysis.
As such, the AXIEM solver algorithm scales on the order of N log(N)
as opposed to N3 (the case for most existing MoM products).
The AXIEM product’s solver technology also enables the user to accurately
and robustly simulate to DC, which is essential for obtaining the right
bias conditions and setting the DC operating points for active structures.
The integrity of these broadband results mitigate any design hiccups
that may be associated with using the “DC to daylight” results in a
subsequent harmonic balance or transient simulation such as those integrated
within AWR’s design environment.
Additionally the AXIEM product
boasts the inclusion of auto-calibrated internal ports, which maintain
their own current return path with relatively low error. These innovative
AXIEM ports eliminate the usual tricks associated with other EM products
that require manual de-embedding or an explicit path to a sidewall (i.e.,
edge ports), and are the ideal excitation for complex structures such
as PCBs with many surface-mount pads.
Meshing Technology The
AXIEM product features an advanced hybrid meshing technology that automatically
fractures structures with triangular and rectangular elements and is
optimized to maximize accuracy with minimal unknowns. This heuristic
approach extends the capacity reach of AXIEM above and beyond traditional
single element approaches and likewise makes it an excellent EM tool
for signal integrity analysis of large RF PCB designs.
technology’s meshing algorithm additionally supports “thick metal,”
in that it creates 3D meshes of extruded planar geometries, correctly
accounting for all x, y, and z directed currents on all surfaces. This
unique thick metal capability is a prerequisite for successful design
of 90nm and 65nm RF complementary metal oxide semiconductor (CMOS) problems,
where line thickness is often in parity (1:1 ratio) with line widths.
Similarly, thick metal support is further required to correctly characterize
silicon spiral inductors as well as very large designs like complete
gallium arsenide (GaAs) MMICs.
Design Flow The AXIEM product
as a stand-alone EM solver is a powerful addition to any designer’s
set of tools. A key value of AXIEM, however, lies in its integration
into the overall AWR design flow, where it contributes significantly
to AWR’s commitment to accelerating GHz design. AXIEM is seamlessly
tied to circuit and system simulation, layout, and verification through
the proprietary AWR unified data model (UDM). The UDM provides features
such as extraction directly from simulation without having to perform
explicit layout and EM setup steps, thereby incorporating EM directly
into circuit simulation.
Furthermore, when the AXIEM design
tool is used in conjunction with AWR’s ACE™ technology, which provides
fast, automatic interconnect model extraction, the same EM structures
can be modified and designed in seconds accordingly with ACE and then
more accurately modeled or analyzed within the mainstream design flow
with the AXIEM tool. AWR’s UDM and ACE innovations, now combined with
AXIEM as an integral part of the overall flow, compliment each other
to further cut engineering design time and design iterations from the
Pricing and Availability AXIEM (www.axiem3d.com)
is presently in beta test with select existing customers. The commercial
release is scheduled for Q1 2008. The product is priced at U.S. $30,000
for locked licenses and supports Windows 2000, XP, and Vista. For international
pricing or general availability information, contact your local sales
representative or AWR directly at
firstname.lastname@example.org or 310-726-3000.
Be one of the first to
see AXIEM in action—visit AWR’s Booth 912 at the European Microwave
Conference, October 9-12 in Munich, Germany, to register for a demonstration.
About Applied Wave Research, Inc.
Applied Wave Research
is a leading supplier of high-frequency electronic design automation
(EDA) products for the design of wireless telecommunications equipment,
semiconductors, high-speed computers, networking systems, automotive
mobility systems, and a variety of other electronics-based products.
AWR is a privately-held company with global development offices, sales
offices, training centers, and distribution channels. In 2005, AWR acquired
APLAC Solutions, an emerging leader in simulation and analysis software
for analog and radio-frequency (RF) design, and its RF design technology
that has been used in designing more than 30 percent of all mobile phone
RF integrated circuits (ICs) worldwide. AWR today has over 700 companies
deploying its software worldwide, including virtually every major high-frequency
electronic component and system supplier. The company is headquartered
at 1960 East Grand Avenue, Suite 430, El Segundo, California 90245.
For more information about AWR and the company's products, please visit
www.appwave.com or call 310-726-3000.
AWR, the AWR logo, AXIEM,
and ACE are either registered trademarks or trademarks of Applied Wave
Research, Inc. All other registered marks are the property of their
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