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Fotofab - Press Release 6-10-2008
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Fotofab’s “Dimple Shields” Give Board Level
Engineers Unmatched Flexibility Custom Shields Offer
Easy Board Access Without Wasting Space on Crowded Circuit Boards
Chicago, IL – May 6, 2008. Fotofab, a leading supplier
of precision thin-metal parts, offers RF and board level engineers the
design flexibility and cost efficiency they need to solve tough real
estate issues on congested circuit boards with their custom “dimple”
shields.The dimpled, snap-fit lid permits component access for testing
and other procedures while eliminating the need for space-robbing lid-fixing
hardware. Fotofab's production process allows the latitude to
create shielding solutions without dimensional constraints, even in
complex shapes. This allows engineers to accommodate multiple components
within complex circuit board layouts, all while realizing the cost savings
and fast lead times of Fotofab’s photochemical machining process. Fotofab’s
technical sales staff is available to discuss a shielding solution for
any board. Visit
www.fotofab.com
or reach
sales@fotofab.com,
(773) 463-6211.
About Fotofab
Founded in 1967, Fotofab continues to refine the photochemical machining
process, (also known as chemical etching or milling) to produce custom
precision metal parts in an efficient and environmentally friendly manner.
A veteran supplier to the aerospace, automotive, defense, electronic,
telecommunications, medical manufacturing industries, Fotofab is among
the leading suppliers of precision metal parts including RF/EMI shields,
electrical contacts, screens, connector housings, and more.
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Press contact: Alison Anzalone Phone: 773-463-6211
Alison@fotofab.com
www.fotofab.com
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