Skyworks Unveils Industry’s Smallest WCDMA
Power Amplifiers with Integrated Directional Couplers
Family of Single and Dual-Band Products Designed for Seamless Operation
with UMTS Chipsets;
Addresses Most Widely Used Frequency Bands
 BARCELONA,
Spain − Mobile World Congress − Feb. 16, 2009--Skyworks Solutions, Inc. (NASDAQ:SWKS), an innovator of
high reliability analog and mixed signal semiconductors enabling a broad range of end markets, today introduced a
family of single and dual-band WCDMA power amplifiers (PA) for universal mobile telecommunications system (UMTS)
applications that integrate the directional coupler, significantly reducing the phone board footprint and
bill-of-material costs.
The company’s expanded portfolio of front-end solutions now includes five of the
world’s smallest and highest performance UMTS PAs that support Bands I, II, IV, V and VIII, and two dual band PAs
that support the most popular band combinations – bands I/VIII and II/V. These compact solutions provide seamless
operation and offer high power added efficiency (PAE) at mid and low powers, significantly increasing talk times.
 “Skyworks
is proud to continue its tradition of delivering industry-leading solutions that meet today’s demanding 3G
requirements,” said Gregory L. Waters, executive vice president and general manager, front-end solutions. “Our
newest family of power amplifiers offers significant benefits to handset OEMs who must constantly address size,
cost and performance issues across a broad range of frequencies.”
Skyworks’ Family of WCDMA Power Amplifiers
Skyworks’ Intera™ portfolio now includes the:
SKY77186 for Band I: 1920-1980 MHz
SKY77187 for Band II: 1850-1910 MHz
SKY77188 for Band V, VI: 824-849 MHz
SKY77189 for Band VIII: 880-915 MHz
SKY77191 for Band IV, IX, X: 1710-1785 MHz
The five small and efficient 3 x 3 millimeter (mm) solutions
are fully matched, 10-pad surface mount modules. Because of high efficiencies attained throughout the entire power
range, the devices deliver unsurpassed talk-time advantages. They also meet stringent spectral linearity
requirements of high-speed downlink packet access (HSDPA) data transmission with high PAE.
SKY77195 for Bands I and VIII: 1920-1980 MHz and 880-915 MHz
SKY77196 for Bands II and V: 1850-1910 MHz and 824-849 MHz
The two 4 x 5 mm dual band PA modules
provide convenient solutions for these increasingly popular phone models. Skyworks’ revolutionary integration
techniques pack most of the external passive components into the modules, requiring only two external bypassing
capacitors for the two bands compared to 10-14 passives typically required with two single band PA modules. This
results in unmatched bill of materials count savings as well as up to 40-50 percent board area savings, enabling
OEMs to devote more functionality to the phone without increasing its size.
The single gallium arsenide (GaAs) microwave monolithic integrated circuit (MMIC) contains all active circuitry
in the module. The MMIC contains on-board bias circuitry, as well as input and interstage matching circuits.
Output match into a 50-ohm load is realized off-chip within the module package to optimize efficiency and power
performance.
The PA modules are manufactured with Skyworks’ indium gallium phosphide (InGaP) heterojunction
bipolar transistor (HBT) bipolar field effect transistor (BiFET) process that provides for all positive voltage DC
supply operation while maintaining high efficiency and good linearity.
Pricing and Availability
Samples are currently available, with volume production scheduled
to commence the quarter. For customized pricing, please contact sales@skyworksinc.com.
Skyworks at
Mobile World Congress
Skyworks will be showcasing its portfolio of Intera™ solutions in Hall 8,
Stand C132 at Mobile World Congress, being held February 16-19.
About Skyworks
Skyworks Solutions, Inc. is an innovator of high performance analog and mixed signal semiconductors enabling
mobile connectivity. The company's power amplifiers, front-end modules and direct conversion radios are at the
heart of many of today's leading-edge multimedia handsets. Leveraging core technologies, Skyworks also offers a
diverse portfolio of linear products that support automotive, broadband, cellular infrastructure, industrial and
medical applications.
Headquartered in Woburn, Mass., Skyworks is worldwide with engineering, manufacturing,
sales and service facilities throughout Asia, Europe and North America. For more information, please visit
Skyworks’ Web site at: www.skyworksinc.com.
Amanda Ingalls
Senior Public Relations Manager
Skyworks Solutions, Inc.
5221 California Avenue
Irvine, CA 92617-3073
949-231-3045 (telephone)
949-231-4117 (fax)
amanda.ingalls@skyworksinc.com
www.skyworksinc.com
Safe Harbor Statement
This news release includes "forward-looking
statements" intended to qualify for the safe harbor from liability established by the Private Securities
Litigation Reform Act of 1995. These forward-looking statements include information relating to future results and
expectations of Skyworks (including certain projections and business trends). Forward-looking statements can often
be identified by words such as "anticipates," "expects," "forecasts," "intends," "believes," "plans," "may,"
"will," "continue," similar expressions, and variations or negatives of these words. All such statements are
subject to certain risks and uncertainties that could cause actual results to differ materially and adversely from
those projected, and may affect our future operating results, financial position and cash flows.
These
risks and uncertainties include, but are not limited to: unprecedented uncertainty regarding global economic and
financial market conditions; the susceptibility of the wireless semiconductor industry and the markets addressed
by our, and our customers', products to economic downturns; the timing, rescheduling or cancellation of
significant customer orders and our ability, as well as the ability of our customers, to manage inventory; losses
or curtailments of purchases or payments from key customers, or the timing of customer inventory adjustments;
changes in laws, regulations and/or policies in the United States that could adversely affect financial markets
and our ability to raise capital; our ability to develop, manufacture and market innovative products in a highly
price competitive and rapidly changing technological environment; economic, social and political conditions in the
countries in which we, our customers or our suppliers operate, including security and health risks, possible
disruptions in transportation networks and fluctuations in foreign currency exchange rates; fluctuations in our
manufacturing yields due to our complex and specialized manufacturing processes; delays or disruptions in
production due to equipment maintenance, repairs and/or upgrades; our reliance on several key customers for a
large percentage of our sales; fluctuations in the manufacturing yields of our third party semiconductor foundries
and other problems or delays in the fabrication, assembly, testing or delivery of our products; the availability
and pricing of third party semiconductor foundry, assembly and test capacity and raw materials; our ability to
timely and accurately predict market requirements and evolving industry standards, and to identify opportunities
in new markets; uncertainties of litigation, including potential disputes over intellectual property infringement
and rights, as well as payments related to the licensing and/or sale of such rights; our ability to rapidly
develop new products and avoid product obsolescence; our ability to retain, recruit and hire key executives,
technical personnel and other employees in the positions and numbers, with the experience and capabilities, and at
the compensation levels needed to implement our business and product plans; lengthy product development cycles
that impact the timing of new product introductions; unfavorable changes in product mix; the quality of our
products and any remediation costs; shorter than expected product life cycles; problems or delays that we may face
in shifting our products to smaller geometry process technologies and in achieving higher levels of design
integration; and our ability to continue to grow and maintain an intellectual property portfolio and obtain needed
licenses from third parties, as well as other risks and uncertainties, including but not limited to those detailed
from time to time in our filings with the Securities and Exchange Commission.
These forward-looking statements are made only as of the date hereof, and we undertake no obligation to update or
revise the forward-looking statements, whether as a result of new information, future events or otherwise.
Posted 2/17/2009
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