Electronics World articles Popular Electronics articles QST articles Radio & TV News articles Radio-Craft articles Radio-Electronics articles Short Wave Craft articles Wireless World articles Google Search of RF Cafe website Sitemap Electronics Equations Mathematics Equations Equations physics Manufacturers & distributors Engineer Jobs Twitter LinkedIn Crosswords Engineering Humor Kirt's Cogitations Engineering Event Calendar RF Engineering Quizzes USAF radar shop Notable Quotes App Notes Calculators Education Engineering Magazines RF Cafe Software,T-Shirts,Coffee Mugs Engineering magazine articles Engineering software Engineering smorgasbord RF Cafe Archives RF Cascade Workbook 2018 RF Stencils for Visio RF & EE Shapes for Word Advertising RF Cafe Homepage Sudoku puzzles Facebook Test notes Thank you for visiting RF Cafe!
everythingRF RF & Microwave Company Directory (h) - RF Cafe

Bond Wire Properties

Gold Aluminum Bond Wire Properties (Archimedes Channel - RF CafeWire bonding is the primary method of making interconnections between an integrated circuit (IC) and a printed circuit board (PCB) during semiconductor device fabrication. Although less common, wire bonding can be used to connect an IC to other electronics or to connect from one PCB to another. Wire bonding is generally considered the most cost-effective and flexible interconnect technology, and is used to assemble the vast majority of semiconductor packages. Bond wires usually consist of one of the following materials: Gold - Aluminum - Copper. Wire diameters start at 15 µm and can be up to several hundred micrometers for high-powered applications. There are two main classes of wire bonding: Ball bonding and Wedge bonding. Ball bonding usually is restricted to gold and copper wire and usually requires heat. Wedge bonding can use either gold or aluminum wire, with only the gold wire requiring heat. -Wikipedia

These values (for a constant current) are typical for standard industry bond wire, and could vary from one product to another.

Here is an article gives equations for calculating fusing current when the duty cycle is very small, "Bond Wire Fusing in ICs with Pulsed Current." Note that much larger currents can be handled with very short pulses. Here is the whitepaper for the formula.

This study by Sandia National Laboratories is titled, "1 Mil Gold Bond Wire Study."

Wire Type Diameter
(mils)
Wire Area
(mils2)
Resistivity
(Ω/inch)
Typical DC
Fusing Current
(amps)
Recommended
Bond Pad Size
(mils)
Gold 1.00 0.79 1.16 0.6-0.7 4 x 4
1.30 1.33 0.693 0.9-1.0 5 x 5
1.50 1.77 0.521 1.2-1.4 6 x 6
2.00 3.14 0.294 1.6-2.0 8 x 8
Aluminum 1.00 0.79 1.33 0.27-0.30 3.5 x 3.5
1.25 1.23 0.856 0.4-0.5 4 x 4
1.50 1.77 0.595 0.6-0.7 6 x 6
2.00 3.14 0.335 1.0-1.2 6 x 8
3.00 7.07 0.149 2-2.5 9 x 12
4.00 12.57 0.0838 3.5-4.0 12 x 20
5.00 19.63 0.0537 5-6 15 x 25
8.00 50.27 0.0210 11-12 20 x 32
10.00 78.54 0.0134 16-18 25 x 40
12.00 113.10 0.0093 21-23 30 x 48
15.00 176.71 0.0059 20-35 40 x 60
20.00 314.16 0.0033 50-60 50 x 80

99.99% purity @ 20°C

RF Cascade Workbook 2018 by RF Cafe
Antenna Test Lab - RF Cafe
About RF Cafe
Kirt Blattenberger - RF Cafe Webmaster
Copyright: 1996 - 2018
Webmaster:
    Kirt Blattenberger,
    BSEE - KB3UON

RF Cafe began life in 1996 as "RF Tools" in an AOL screen name web space totaling 2 MB. Its primary purpose was to provide me with ready access to commonly needed formulas and reference material while performing my work as an RF system and circuit design engineer. The Internet was still largely an unknown entity at the time and not much was available in the form of WYSIWYG ...

All trademarks, copyrights, patents, and other rights of ownership to images and text used on the RF Cafe website are hereby acknowledged.

My Hobby Website:  AirplanesAndRockets.com

spacer