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Military & Industry Standard Documents

Government bureaucracy is notoriously... bureaucratic. Commercial entities have learned the ropes all too well, unfortunately. Having needed to locate test methods for both government and commercial purposes and having some trouble doing so, I decided to make my own list. Here it is. Please let me know if you have any others that should be added to the list.



DoD = Department of Defense,
           MIL-STD-883 download

IPC = Association Connecting Electronics Industries

JEDEC = Joint Electron Device Engineering Council



Authority Standard Test
Method
Title
DoD MIL-STD-883E 1001 Barometric pressure, reduced (altitude operation)
DoD MIL-STD-883E 1002 Immersion
DoD MIL-STD-883E 1003 Insulation resistance
DoD MIL-STD-883E 1004.7 Moisture resistance
DoD MIL-STD-883E 1005.8 Steady state life
DoD MIL-STD-883E 1006 Intermittent life
DoD MIL-STD-883E 1007 Agree life
DoD MIL-STD-883E 1008.2 Stabilization bake
DoD MIL-STD-883E 1009.8 Salt atmosphere (corrosion)
DoD MIL-STD-883E 1010.7 Temperature cycling
DoD MIL-STD-883E 1011.9 Thermal shock
DoD MIL-STD-883E 1012.1 Thermal characteristics
DoD MIL-STD-883E 1013 Dew point
DoD MIL-STD-883E 1014.1 Seal
DoD MIL-STD-883E 1015.9 Burn-in test
DoD MIL-STD-883E 1016 Life/reliability characterization tests
DoD MIL-STD-883E 1017.2 Neutron irradiation
DoD MIL-STD-883E 1015.2 Internal water-vapor content
DoD MIL-STD-883E 1019.4 Ionizing radiation (total dose) test procedure
DoD MIL-STD-883E 1020.1 Dose rate induced latchup test procedure
DoD MIL-STD-883E 1021.2 Dose rate upset testing of digital microcircuits
DoD MIL-STD-883E 1022 Mosfet threshold voltage
DoD MIL-STD-883E 1023.2 Dose rate response of linear microcircuits
DoD MIL-STD-883E 1030.1 Preseal burn-in
DoD MIL-STD-883E 1031 Thin film corrosion test
DoD MIL-STD-883E 1032.1 Package induced soft error test procedure (due to alpha particles)
DoD MIL-STD-883E 1033 Endurance life test
DoD MIL-STD-883E 1034 Die penetrant test (for plastic devices)
DoD MIL-STD-883E 2001.2 Constant acceleration
DoD MIL-STD-883E 2002.3 Mechanical shock
DoD MIL-STD-883E 2003.7 Solderability
DoD MIL-STD-883E 2004.5 Lead integrity
DoD MIL-STD-883E 2005.2 Vibration fatigue
DoD MIL-STD-883E 2006.1 Vibration noise
DoD MIL-STD-883E 2007.2 Vibration, variable frequency
DoD MIL-STD-883E 2008.1 Visual and mechanical
DoD MIL-STD-883E 2009.9 External visual
DoD MIL-STD-883E 2010.10 Internal visual (monolithic)
DoD MIL-STD-883E 2011.7 Bond strength (destructive bond pull test)
DoD MIL-STD-883E 2012.7 Radiography
DoD MIL-STD-883E 2013.1 Internal visual inspection for DPA
DoD MIL-STD-883E 2014 Internal visual and mechanical
DoD MIL-STD-883E 2015.11 Resistance to solvents
DoD MIL-STD-883E 2016 Physical dimensions
DoD MIL-STD-883E 2017.7 Internal visual (hybrid)
DoD MIL-STD-883E 2015.3 Scanning electron microscope (SEM) inspection of metallization
DoD MIL-STD-883E 2019.5 Die shear strength
DoD MIL-STD-883E 2020.7 Particle impact noise detection test
DoD MIL-STD-883E 2021.3 Glassivation layer integrity
DoD MIL-STD-883E 2022.2 Wetting balance solderability
DoD MIL-STD-883E 2023.5 Nondestructive bond pull
DoD MIL-STD-883E 2024.2 Lid torque for glass-frit-sealed packages
DoD MIL-STD-883E 2025.4 Adhesion of lead finish
DoD MIL-STD-883E 2026 Random vibration
DoD MIL-STD-883E 2027.2 Substrate attach strength
DoD MIL-STD-883E 2028.4 Pin grid package destructive lead pull test
DoD MIL-STD-883E 2029 Ceramic chip carrier bond strength
DoD MIL-STD-883E 2030 Ultrasonic inspection of die attach
DoD MIL-STD-883E 2031.1 Flip chip pull-off test
DoD MIL-STD-883E 2032.1 Visual inspection of passive elements
DoD MIL-STD-883E 2035 Ultrasonic inspection of TAB bonds
DoD MIL-STD-883E 3001.1 Drive source, dynamic
DoD MIL-STD-883E 3002.1 Load conditions
DoD MIL-STD-883E 3003.1 Delay measurements
DoD MIL-STD-883E 3004.1 Transition time measurements
DoD MIL-STD-883E 3005.1 Power supply current
DoD MIL-STD-883E 3006.1 High level output voltage
DoD MIL-STD-883E 3007.1 Low level output voltage
DoD MIL-STD-883E 3008.1 Breakdown voltage, input or output
DoD MIL-STD-883E 3009.1 Input current, low level
DoD MIL-STD-883E 3010.1 Input current, high level
DoD MIL-STD-883E 3011.1 Output short circuit current
DoD MIL-STD-883E 3012.1 Terminal capacitance
DoD MIL-STD-883E 3013.1 Noise margin measurements for digital microelectronic devices
DoD MIL-STD-883E 3014 Functional testing
DoD MIL-STD-883E 3015.7 Electrostatic discharge sensitivity classification
DoD MIL-STD-883E 3016 Activation time verification
DoD MIL-STD-883E 3017 Microelectronics package digital signal transmission
DoD MIL-STD-883E 3015 Crosstalk measurements for digital microelectronic device packages
DoD MIL-STD-883E 3019.1 Ground and power supply impedance measurements for digital microelectronics device packages
DoD MIL-STD-883E 3020 High impedance (off-state) low-level output leakage current
DoD MIL-STD-883E 3021 High impedance (off-state) high-level output leakage current
DoD MIL-STD-883E 3022 Input clamp voltage
DoD MIL-STD-883E 3023 Static latch-up measurements for digital CMOS microelectronic devices
DoD MIL-STD-883E 3024 Simultaneous switching noise measurements for digital microelectronic devices
DoD MIL-STD-883E 4001.1 Input offset voltage and current and bias current
DoD MIL-STD-883E 4002.1 Phase margin and slew rate measurements
DoD MIL-STD-883E 4003.1 Common mode input voltage range, Common mode rejection ratio, Supply voltage rejection ratio
DoD MIL-STD-883E 4004.1 Open loop performance
DoD MIL-STD-883E 4005.1 Output performance
DoD MIL-STD-883E 4006.1 Power gain and noise figure
DoD MIL-STD-883E 4007 Automatic gain control range
DoD MIL-STD-883E 5001 Parameter mean value control
DoD MIL-STD-883E 5002.1 Parameter distribution control
DoD MIL-STD-883E 5003 Failure analysis procedures for microcircuits
DoD MIL-STD-883E 5004.10 Screening procedures
DoD MIL-STD-883E 5005.13 Qualification and quality conformance procedures
DoD MIL-STD-883E 5006 Limit testing
DoD MIL-STD-883E 5007.6 Wafer lot acceptance
DoD MIL-STD-883E 5008.8 Test procedures for hybrid and multichip microcircuits
DoD MIL-STD-883E 5009.1 Destructive physical analysis
DoD MIL-STD-883E 5010.3 Test procedures for custom monolithic microcircuits
DoD MIL-STD-883E 5011.4 Evaluation and acceptance procedures for polymeric adhesives.
DoD MIL-STD-883E 5012.1 Fault coverage measurement for digital microcircuits.
DoD MIL-STD-883E 5013 Wafer fabrication control and wafer acceptance procedures for processed GaAs wafers.
IPC TM-650 2.1.1D Microsectioning - 3/98
IPC TM-650 2.1.1.1 Microsectioning, Ceramic Substrate - 12/87
IPC TM-650 2.1.1.2 Microsectioning - Semi or Automatic Technique Microsection Equipment (Alternate) - 7/93
IPC TM-650 2.1.2A Pinhole Evaluation, Dye Penetration Method - 3/76
IPC TM-650 2.1.3A Plated-Through Hole Structure Evaluation - 8/76
IPC TM-650 2.1.5A Surface Examination, Unclad and Metal Clad Material - 12/82
IPC TM-650 2.1.6B Thickness of Glass Fabric - 12/94
IPC TM-650 2.1.6.1 Weight of Fabric Reinforcements - 12/94
IPC TM-650 2.1.7C Thread Count of Glass Fabric - 12/94
IPC TM-650 2.1.7.1 Thread Count, Organic Fibers - 12/87
IPC TM-650 2.1.8B Workmanship - 12/94
IPC TM-650 2.1.9 Surface Scratch Examination Metal Clad Foil - 5/86
IPC TM-650 2.1.10A Visual Inspection for Undissolved Dicyandiamide - 12/94
IPC TM-650 2.1.13A Inspection for Inclusions and Voids in Flexible Printed Wiring Materials - 5/98
IPC TM-650 2.2.1A Mechanical Dimensional Verification - 8/97
IPC TM-650 2.2.2B Optical Dimensional Verification - 8/97
IPC TM-650 2.2.4C Dimensional Stability, Flexible Dielectric Materials - 5/98
IPC TM-650 2.2.5A Dimensional Inspections Using Mircosections - 8/97
IPC TM-650 2.2.6A Hole Size Measurement, Drilled - 8/97
IPC TM-650 2.2.7A Hole Size Measurement, Plated - 5/86
IPC TM-650 2.2.8 Location of Holes - 4/73
IPC TM-650 2.2.10A Hole Location and Conductor Location - 12/83
IPC TM-650 2.2.12A Thickness of Copper by Weight- 3/76
IPC TM-650 2.2.12.1 Overall Thickness and Profile Factor of Copper Foils Treated and Untreated - 9/87
IPC TM-650 2.2.12.2 Weight and Thickness of Copper Foils with Releasable Carriers - 7/89
IPC TM-650 2.2.12.3 Weight and Thickness Determination of Copper Foils With Etchable Carriers - 7/89
IPC TM-650 2.2.13.1A Thickness, Plating in Holes, Microhm Method - 1/83
IPC TM-650 2.2.14 Solder Powder Particle Size Distribution - Screen Method for Types 1-4 - 1/95
IPC TM-650 2.2.14.1 Solder Powder Particle Size Distribution - Measuring Microscope Method - 1/95
IPC TM-650 2.2.14.2 Solder Powder Particle Size Distribution - Optical Image Analyzer Method--1/95
IPC TM-650 2.2.14.3 Determination of Maximum Solder Powder Particle Size - 1/95
IPC TM-650 2.2.15 Cable Dimensions (Flat Cable) - 6/79
IPC TM-650 2.2.16 Artwork Master Evaluation by Use of a Drilled Panel - 12/87
IPC TM-650 2.2.16.1 Artwork Master Evaluation by Overlay - 12/87
IPC TM-650 2.2.17 Surface Roughness and Profile of Metallic Foils (Contacting Stylus Technique)- 3/90
IPC TM-650 2.2.15 Determination of Thickness of Laminates by Mechanical Measurement - 12/94
IPC TM-650 2.2.15.1 Determination of Thickness of Metallic Clad Laminates, Cross-sectional - 12/94
IPC TM-650 2.2.19 Measuring Hole Pattern Location-12/87
IPC TM-650 2.2.19.1 Length, Width and Perpendicularity of Laminate and Prepreg Panels - 12/94
IPC TM-650 2.2.20 Solder Paste Metal Content by Weight - 1/95
IPC TM-650 2.2.21 Planarity of Dielectrics for High Density Interconnection (HDI) Microvia Technology - 11-98
IPC TM-650 2.3.1 Chemical Processing, Suitable Processing Material- 4/73
IPC TM-650 2.3.1.1B Chemical Cleaning of Metal Clad Laminates- 5/86
IPC TM-650 2.3.2F Chemical Resistance Of Flexible Printed Wiring Materials - 5/98
IPC TM-650 2.3.3A Chemical Resistance of Insulating Materials- 2/78
IPC TM-650 2.3.4B Chemical Resistance, Marking Paints and Inks - 8/97
IPC TM-650 2.3.4.2A Chemical Resistance of Laminates, Prepreg and Coated Foil Products, by Solvent Exposure - 12/94
IPC TM-650 2.3.4.3 Chemical Resistance of Core Materials to Methylene Chloride- 5/86
IPC TM-650 2.3.5B Density, Insulating Material - 8/97
IPC TM-650 2.3.6A Etching, Ammonium Persulfate Method - 7/75
IPC TM-650 2.3.7A Etching, Ferric Chloride Method - 7/75
IPC TM-650 2.3.7.1A Cupric Chloride Etching Method - 12/94
IPC TM-650 2.3.7.2A Alkaline Etching Method - 12/94
IPC TM-650 2.3.8A Flammability, Flexible Insulating Materials- 12/82
IPC TM-650 2.3.8.1 Flammability of Flexible Printed Wiring- 12/88
IPC TM-650 2.3.9D Flammability of Prepreg and Thin Laminate - 8/97
IPC TM-650 2.3.10B Flammability of Laminate - 12/94
IPC TM-650 2.3.10.1 Flammability of Soldermask on Printed Wiring Laminate- 8/98
IPC TM-650 2.3.11 Glass Fabric Construction- 4/73
IPC TM-650 2.3.13 Determination of Acid Value of Liquid Solder Flux- Potentiometric and Visual Titration Methods- 1/95
IPC TM-650 2.3.14 Print, Etch, and Plate Test- 4/73
IPC TM-650 2.3.15C Purity, Copper Foil or Plating - 8/97
IPC TM-650 2.3.16B Resin Content of Prepreg, by Burn-off - 12/94
IPC TM-650 2.3.16.1C Resin Content of Prepreg, by Treated Weight--12/94
IPC TM-650 2.3.16.2 Treated Weight of Prepreg - 12/94
IPC TM-650 2.3.17D Resin Flow Percent of Prepreg - 8/97
IPC TM-650 2.3.17.1B Resin Flow of Adhesive Coated Films and Unsupported Adhesive Films - 5/98
IPC TM-650 2.3.17.2B Resin Flow of "No Flow" Prepreg - 8/97
IPC TM-650 2.3.15A Gel Time, Prepreg Materials - 4/86
IPC TM-650 2.3.19C Volatile Content of Prepreg - 12/94
IPC TM-650 2.3.20 Plating Quality, Hull Cell Method - 8/97
IPC TM-650 2.3.22 Copper Protective Coating Quality - 2-78
IPC TM-650 2.3.23B Cure (Permanency) Thermally Cured Solder Mask - 2/88
IPC TM-650 2.3.23.1A Cure (Permanency) UV Initiated Dry Film Solder Mask - 2/88
IPC TM-650 2.3.24 Porosity of Gold Plating- 2/78
IPC TM-650 2.3.24.1 Porosity Testing of Gold Electrodeposited on a Nickel Plated Copper Substrate Electrographic Method - 10/85
IPC TM-650 2.3.24.2A Porosity of Metallic Coatings on Copper-Based Alloys and Nickel (Nitric Acid Vapor Test) - 8/97
IPC TM-650 2.3.25B Detection and Measurement of Ionizable Surface Contaminants - 8/97
IPC TM-650 2.3.26A Ionizable Detection of Surface Contaminants (Dynamic Method) - 11/94
IPC TM-650 2.3.26.1 Ionizable Detection of Surface Contaminants (Static Method) - 11/94
IPC TM-650 2.3.26.2 Mobile Ion Content of Polymer Films - 7/95
IPC TM-650 2.3.27 Cleanliness Test - Residual Rosin - 1/95
IPC TM-650 2.3.27.1 Rosin Flux Residue Analysis-HPLC Method - 1/95
IPC TM-650 2.3.28 Ionic Analysis of Circuit Boards, Ion Chromatography Method - 1/95
IPC TM-650 2.3.29 Flammability, Flexible Flat Cable- 11/88
IPC TM-650 2.3.30A Solvent pH Determination in Anhydrous Flourocarbon Solvents- 11/81
IPC TM-650 2.3.31 Relative Degree of Cure of U.V. Curable Material - 2/88
IPC TM-650 2.3.32C Flux Induced Corrosion (Copper Mirror Method)- 1/95
IPC TM-650 2.3.33C Presence of Halides in Flux, Silver Chromate Method - 1/95
IPC TM-650 2.3.34B Solids Content, Flux - 1/95
IPC TM-650 2.3.34.1B Percentage of Flux on/in Flux-Coated and/or Flux-Cored Solder - 1/95
IPC TM-650 2.3.35B Halide Content, Quantitative (Chloride and Bromide)- 1/95
IPC TM-650 2.3.35.1 Fluorides by Spot Test, Fluxes - Qualitative - 1/95
IPC TM-650 2.3.35.2 Flouride Concentration, Fluxes - Quantitative--1/95
IPC TM-650 2.3.36 Acid Acceptance of Chlorinated Solvents- 10/85
IPC TM-650 2.3.37B Volatile Content of Adhesive Coated Dielectric Films - 5/98
IPC TM-650 2.3.38B Surface Organic Contaminant Detection Test - 8/97
IPC TM-650 2.3.39B Surface Organic Contaminant Identification Test (Infrared Analytical Method) - 8/97
IPC TM-650 2.3.40 Thermal Stability - 7/95
IPC TM-650 2.4.1D Adhesion, Tape Testing--8/97
IPC TM-650 2.4.1.1B Adhesion, Marking Paints and Inks--11/88
IPC TM-650 2.4.1.2 Adhesion of Conductors on Hybrid Substrates--12/87
IPC TM-650 2.4.1.3 Adhesion, Resistors (Hybrid Circuits)--12/87
IPC TM-650 2.4.1.4 Adhesion, Overglaze (Hybrid Circuits)--12/87
IPC TM-650 2.4.1.5A Determination of Heat Transfer--5/95
IPC TM-650 2.4.1.6 Adhesion, Polymer Coating--7/95
IPC TM-650 2.4.2A Ductility of Copper Foil--3/76
IPC TM-650 2.4.2.1D Flexural Fatigue and Ductility, Foil--3/91
IPC TM-650 2.4.3D Flexural Fatigue, Flexible Printed Wiring Materials--5/98
IPC TM-650 2.4.3.1C Flexural Fatigue and Ductility, Flexible Printed Wiring--3/91
IPC TM-650 2.4.3.2C Flexural Fatigue and Ductility, Flexible Metal-Clad Dielectrics--3/91
IPC TM-650 2.4.4B Flexural Strength of Laminates (at Ambient Temperature)--12/94
IPC TM-650 2.4.4.1A Flexural Strength of Laminates (at Elevated Temperature)--12/94
IPC TM-650 2.4.5 Folding Endurance, Flexible Printed Wiring Materials--4/73
IPC TM-650 2.4.6 Hot Oil--4/73
IPC TM-650 2.4.7A Machinability, Printed Wiring Materials--7/75
IPC TM-650 2.4.8C Peel Strength of Metallic Clad Laminates--12/94
IPC TM-650 2.4.8.1 Peel Strength, Metal Foil (Keyhole Method for Thin Laminates)--1/86
IPC TM-650 2.4.8.2A Peel Strength of Metallic Clad Laminates at Elevated Temperature (Hot Fluid Method)--12/94
IPC TM-650 2.4.8.3A Peel Strength of Metallic Clad Laminates at Elevated Temperature (Hot Air Method)--12/94
IPC TM-650 2.4.8.4 Carrier Release, Thin Copper--1/90
IPC TM-650 2.4.9D Peel Strength, Flexible Dielectric Materials--10/88
IPC TM-650 2.4.9.1 Peel Strength of Flexible Circuits - 11/98
IPC TM-650 2.4.9.2 Bonding Process - 11/98
IPC TM-650 2.4.10 Plating Adhesion--4/73
IPC TM-650 2.4.11 Shear Strength Flexible Dielectric Materials--4/73
IPC TM-650 2.4.12A Solderability, Edge Dip Method--6/91
IPC TM-650 2.4.13F Solder Float Resistance Flexible Printed Wiring Materials--5/98
IPC TM-650 2.4.13.1 Thermal Stress of Laminates--12/94
IPC TM-650 2.4.14 Solderability of Metallic Surfaces--4/73
IPC TM-650 2.4.14.1 Solderability, Wave Solder Method--3/79
IPC TM-650 2.4.14.2 Liquid Flux Activity, Wetting Balance Method--1/95
IPC TM-650 2.4.15A Surface Finish, Metal Foil--3/76
IPC TM-650 2.4.16A Initiation Tear Strength, Flexible Insulating Materials--12/82
IPC TM-650 2.4.17 Tear Strength, Propagation--4/73
IPC TM-650 2.4.17.1A Propagation, Tear Strength, Flexible Insulating Materials--12/82
IPC TM-650 2.4.15B Tensile Strength and Elongation, Copper Foil--8/80
IPC TM-650 2.4.15.1 Tensile Strength and Elongation, In-House Plating--8/97
IPC TM-650 2.4.15.2 Hot Rupture Strength, Foil--7/89
IPC TM-650 2.4.15.3 Tensile Strength, Elongation, and Modulus--7/95
IPC TM-650 2.4.19C Tensile Strength and Elongation, Flexible Printed Wiring Materials--5/98
IPC TM-650 2.4.20 Terminal Bond Strength, Flexible Printed Wiring--4/73
IPC TM-650 2.4.21D Land Bond Strength, Unsupported Component Hole--8/97
IPC TM-650 2.4.21.1C Bond Strength, Surface Mount Lands Perpendicular Pull Method--5/91
IPC TM-650 2.4.22C Bow and Twist (Percentage)--6/99
IPC TM-650 2.4.22.1C Bow and Twist-Laminate--5/93
IPC TM-650 2.4.22.2 Substrate Curvature: Silicon Wafers with Deposited Dielectrics--7/95
IPC TM-650 2.4.23 Soldering Resistance of Laminate Materials--3/79
IPC TM-650 2.4.24C Glass Transition Temperature and Z-Axis Thermal Expansion by TMA--12/94
IPC TM-650 2.4.24.1 Time to Delamination (TMA Method)--12/94
IPC TM-650 2.4.24.2 Glass Transition Temperature of Organic Films - DMA Method--7/95
IPC TM-650 2.4.24.3 Glass Transition Temperature of Organic Films - TMA Method--7/95
IPC TM-650 2.4.24.4 Glass Transition and Modulus of Materials Used in High Density Interconnection (HDI) and Microvias -DMA Method - 11/98
IPC TM-650 2.4.24.5 Glass Transition Temperature and Thermal Expansion of Materials Used In High Density Interconnection (HDI) and Microvias -TMA Method -11/98
IPC TM-650 2.4.25C Glass Transition Temperature and Cure Factor by DSC--12/94
IPC TM-650 2.4.26 Tape Test for Additive Printed Boards--3/79
IPC TM-650 2.4.27.1B Abrasion (Taber Method), Solder Mask and Conformal Coating--1/95
IPC TM-650 2.4.27.2A Solder Mask Abrasion (Pencil Method)--2/88
IPC TM-650 2.4.28B Adhesion, Solder Mask (Non-Melting Metals)--8/97
IPC TM-650 2.4.28.1B Adhesion, Solder Resist (Mask), Tape Test Method--8/97
IPC TM-650 2.4.29B Adhesion, Solder Mask, Flexible Circuit--2/88
IPC TM-650 2.4.30 Impact Resistance, Polymer Film--10/86
IPC TM-650 2.4.31A Folding, Flexible Flat Cable--4/86
IPC TM-650 2.4.32A Fold Temperature Testing, Flexible Flat Cable--4/86
IPC TM-650 2.4.33C Flexural Fatigue and Ductility, Flat Cable--3/91
IPC TM-650 2.4.34 Solder Paste Viscosity - T-Bar Spin Spindle Method (applicable for 300,000 to 1,600,000 Centipose)--1/95
IPC TM-650 2.4.34.1 Solder Paste Viscosity - T-Bar Spindle Method (Applicable at Less Than 300,000 Centipose)--1/95
IPC TM-650 2.4.34.2 Solder Paste Viscosity - Spiral Pump Method (Applicable for 300,000 to 1,600,000 Centipose)--1/95
IPC TM-650 2.4.34.3 Solder Paste Viscosity - Spiral Pump Method (Applicable at Less Than 300,000 Centipose)--1/95
IPC TM-650 2.4.34.4 Paste Flux Viscosity - T-Bar Spindle Method--1/95
IPC TM-650 2.4.35 Solder Paste - Slump Test--1/95
IPC TM-650 2.4.36B Rework Simulation, Plated-Through Holes for Leaded Components--8/97
IPC TM-650 2.4.37A Evaluation of Hand Soldering Tools for Terminal Connections--7/91
IPC TM-650 2.4.37.1A Evaluation of Hand Soldering Tools for Printed Wiring Board Applications--7/91
IPC TM-650 2.4.37.2 Evaluation of Hand Soldering Tools on Heavy Thermal Loads--7/93
IPC TM-650 2.4.38A Prepeg Scaled Flow Testing--6/91
IPC TM-650 2.4.39A Dimensional Stability, Glass Reinforced Thin Laminates--2/86
IPC TM-650 2.4.40 Inner Layer Bond Strength of Multilayer Printed Circuit Boards--10/87
IPC TM-650 2.4.41 Coefficient of Lintear Thermal Expansion of Electrical Insulating Boards--3/86
IPC TM-650 2.4.41.1A Coefficient of Thermal Expansion by the Vitreous Silica (Quartz) Dilatometer Method--8/97
IPC TM-650 2.4.41.2 Coefficient of Thermal Expansion - Strain Gage Method--8/97
IPC TM-650 2.4.41.3 In-Plane Coefficient of Thermal Expansion, Organic Films--7/95
IPC TM-650 2.4.41.4 Volumetric Thermal Expansion Polymer Coatings on Inorganic Substrates--7/95
IPC TM-650 2.4.42 Torsional Strength of Chip Adhesives--2/88
IPC TM-650 2.4.42.1 High Tempreature Mechanical Strength Retention of Adhesives--3/88
IPC TM-650 2.4.42.2 Die Shear Strength--2/98
IPC TM-650 2.4.42.3 Wire Bond Pull Strength--2/98
IPC TM-650 2.4.43 Solder Paste - Solder Ball Test--1/95
IPC TM-650 2.4.44 Solder Paste - Tack Test--3/98
IPC TM-650 2.4.45 Solder Paste - Wetting Test--1/95
IPC TM-650 2.4.46 Spread Test, Liquid or Extracted Solder Flux, Solder Paste and Extracted Cored Wires or Preforms--1/95
IPC TM-650 2.4.47 Flux Residue Dryness--1/95
IPC TM-650 2.4.48 Spitting of Flux-Cored Wire Solder--1/95
IPC TM-650 2.4.49 Solder Pool Test--1/95
IPC TM-650 2.4.50 Thermal Conductivity, Polymer Films--7/95
IPC TM-650 2.4.51 Self Shimming Thermally Conductive Adhesives--1/95
IPC TM-650 2.5.1B Arc Resistance of Printed Wiring Materials--5/86
IPC TM-650 2.5.2A Capacitance of Insulating Materials--7/75
IPC TM-650 2.5.3B Current Breakdown, Plated Through Holes--8/97
IPC TM-650 2.5.4 Current Carrying Capacity, Multilayer Printed Wring--4/73
IPC TM-650 2.5.4.1A Conductor Temperature Rise Due to Current Changes in Conductors--8/97
IPC TM-650 2.5.5A Dielectric Constant of Printed Wiring Materials--7/75
IPC TM-650 2.5.5.1B Permittivity (Dielectric Constant) and Loss Tangent (Dissipation Factor) of Insulating Material at 100MHz (Contacting Electrode Systems)--5/86
IPC TM-650 2.5.5.2A Dielectric Constant and Dissipation Factor of Printed Wiring Board Material--Clip Method--12/87
IPC TM-650 2.5.5.3C Permittivity (Dielectric Constant) and Loss Tangent (Dissipation Factor) of Materials (Two Fluid Cell Method)--12/87
IPC TM-650 2.5.5.4 Dielectric Constant and Dissipation Factor of Printed Wiring Board Material--Micrometer Method--10/85
IPC TM-650 2.5.5.5C Stripline Test for Permittivity and Loss Tangent (Dielectric Constant and Dissipation Factor) at X-Band--3/98
IPC TM-650 2.5.5.5.1 Stripline Test for Complex Relative Permittivity of Circuit Board Materials to 14 GHZ--3/98
IPC TM-650 2.5.5.6 Non-Destructive Full Sheet Resonance Test for Permittivity of Clad Laminates--5/89
IPC TM-650 2.5.5.7 Characteristic Impedance and Time Delay of Lines on Printed Boards by TDR--11/92
IPC TM-650 2.5.5.8 Low Frequency Dielectric Constant and Loss Tangent, Polymer Films--7/95
IPC TM-650 2.5.5.9 Permittivity and Loss Tangent, Parallel Plate, 1MHz to 1.5 GHz--11/98
IPC TM-650 2.5.6B Dielectric Breakdown of Rigid Printed Wiring Material--5/86
IPC TM-650 2.5.6.1A Dielectric Strength, Polymer Solder Mask and/or Conformal Coatings--2/88
IPC TM-650 2.5.6.2A Electric Strength of Printed Wiring Material--8/97
IPC TM-650 2.5.6.3 Dielectric Breakdown Voltage and Dielectric Strength--10/86
IPC TM-650 2.5.7C Dielectric Withstanding Voltage, PWB--8/97
IPC TM-650 2.5.8A Dissipation Factor of Flexible Printed Wiring Material--7/75
IPC TM-650 2.5.10A Insulation Resistance, Multilayer Printed Wiring (Between Layers)--12/87
IPC TM-650 2.5.10.1 Insulation Resistivity for Adhesive Interconnection Bonds--11/98
IPC TM-650 2.5.11 Insulation Resistance, Multilayer Printed Wiring (Within a Layer)--4/73
IPC TM-650 2.5.12 Interconnection Resistance, Multilayer Printed Wiring--4/73
IPC TM-650 2.5.13A Resistance of Copper Foil--3/76
IPC TM-650 2.5.14A Resistivity of Copper Foil--8/76
IPC TM-650 2.5.15A Guidelines and Test Methods for RFI-EMI Shielding of Flat Cable--10/86
IPC TM-650 2.5.16A Shorts, Internal on Multilayer Printed Wiring--11/88
IPC TM-650 2.5.17E Volume Resistivity and Surface Resistance of Printed Wiring Materials--5/98
IPC TM-650 2.5.17.1A Volume and Surface Resistivity of Dielectric Materials--12/94
IPC TM-650 2.5.17.2 Volume Resistivity of Conductive Resistance Used in High Dentisty Interconnection (HDI) and Microvias, Two-Wire Method--11/98
IPC TM-650 2.5.15B Characteristic Impedance Flat Cables (Unbalanced)--7/84
IPC TM-650 2.5.19A Propagation Delay of Flat Cables Using Time Domain Reflectometer--7/84
IPC TM-650 2.5.19.1A Propagation Delay of Flat Cables Using Time Domain Reflectometer (TDR)--7/84
IPC TM-650 2.5.21A Digital Unbalanced Crosstalk, Flat Cable--3/84
IPC TM-650 2.5.24 Conductor Resistance, Flexible Flat Cable--6/79
IPC TM-650 2.5.25A Dielectric Withstand Voltage Flexible Fat Cable--11/85
IPC TM-650 2.5.26A Insulation Resistance Flexible Flat Cable--11/85
IPC TM-650 2.5.27 Surface Insulation Resistance of Raw Printed Wiring Board Material--3/79
IPC TM-650 2.5.28A Q Resonance, Flexible Printed Wiring Materials--4/88
IPC TM-650 2.5.30 Balanced and Unbalanced Cable Attenuation Measurements--12/87
IPC TM-650 2.5.31 Current Leakage (Through Overglaze Films)--12/87
IPC TM-650 2.5.32 Resistance Test, Plated Through-Holes--12/87
IPC TM-650 2.5.33 Measurement of Electrical Overstress from Soldering Hand Tools--11/98
IPC TM-650 2.5.33.1 Measurement of Electrical Overstress from Soldering Hand Tools (Ground Measurements)--11/98
IPC TM-650 2.5.33.2 Measurement of Electrical Overstress from Soldering Hand Tools (Transient Measurements)--11/98
IPC TM-650 2.5.33.3 Measurement of Electrical Overstress from Soldering Hand Tools (Current Leakage Measurements)--11/98
IPC TM-650 2.5.33.4 Measurement of Electrical Overstress from Soldering Hand Tools (Shielded Enclosure)--11/98
IPC TM-650 2.6.1E Fungus Resistance Printed Wiring Materials--8/97
IPC TM-650 2.6.2C Water Absorption, Flexible Printed Wiring--5/98
IPC TM-650 2.6.2.1A Water Absorption, Metal Clad Plastic Laminates--5/86
IPC TM-650 2.6.3E Moisture and Insulation Resistance, Printed Boards--8/97
IPC TM-650 2.6.3.1C Moisture and Insulation Resistance-Polymeric Solder Masks and Conformal Coatings--11/98
IPC TM-650 2.6.3.2B Moisture and Insulation Resistance, Flexible Base Dielectric--5/88
IPC TM-650 2.6.3.3A Surface Insulation Resistance, Fluxes--1/95
IPC TM-650 2.6.4A Outgassing, Printed Boards--8/97
IPC TM-650 2.6.5C Physical Shock, Multilayer Printed Wiring--8/97
IPC TM-650 2.6.6B Temperature Cycling, Printed Wiring Board--12/87
IPC TM-650 2.6.7A Thermal Shock and Continuity, Printed Board--8/97
IPC TM-650 2.6.7.1 Thermal Shock--Polymer Solder Mask Coatings--2/88
IPC TM-650 2.6.7.2A Thermal Shock, Continuity and Microsection, Printed Board--8/97
IPC TM-650 2.6.8D Thermal Stress, Plated Through-Holes--3/98
IPC TM-650 2.6.8.1 Thermal Stress, Laminate--9/91
IPC TM-650 2.6.9A Vibration, Rigid Printed Wiring--8/97
IPC TM-650 2.6.9.1 Test to Determine Sensitivity of Electronic Assemblies to Ultrasonic Energy--1/95
IPC TM-650 2.6.9.2 Test to Determine Sensitivity of Electronic Components to Ultrasonic Energy--1/95
IPC TM-650 2.6.10A X-Ray (Radiography), Multilayer Printed Wiring Board Test Methods--8/97
IPC TM-650 2.6.11B Hydrolytic Stability Solder Mask and/or Conformal Coating--11/88
IPC TM-650 2.6.12 Temperature Testing, Flexible Flat Cable--6/79
IPC TM-650 2.6.13 Assessment of Susceptibility to Metallic Dendritic Growth: Uncoated Printed Wiring--10/85
IPC TM-650 2.6.14A Resistance to Electrochemical Migration, Polymer Solder Mask--8/87
IPC TM-650 2.6.15B Corrosion, Flux--1/95
IPC TM-650 2.6.16 Pressure Vessel Method for Glass Epoxy Laminate Integrity--7/85
IPC TM-650 2.6.16.1 Moisture Resistance of HDIS Under High Temperature and Pressure (Pressure Vessel)--8/98
IPC TM-650 2.6.17 Hydrolitic Stability, Flexible Printed Wiring Material--12/82
IPC TM-650 2.6.15A Low Temperature Flexibility, Flexible Printed Wiring Materials--7/85
IPC TM-650 2.6.19 Environmental and Insulation Resistance Test of Hybrid Ceramic Multilayer Substrate Boards--12/87
IPC TM-650 2.6.20A Assessment of Plastic Encapsulated Electronic Components for Susceptibility to Moisture/Reflow Induced Damage--1/95
IPC TM-650 2.6.21 Service Temperature of Flexible Printed Wiring--12/88
IPC TM-650 2.6.22 Superseded by J-STD-035
IPC TM-650 2.6.23 Test Procedure for Steam Ager Temperature Repeatability--7/93
JEDEC JESD-22 22-A100-A Cycled Temperature Humidity Bias Life Test
JEDEC JESD-22 22-A101-B Steady State Temperature Humidity Bias Life Test
JEDEC JESD-22 22-A102-B Accelerated Moisture Resistance - Unbiased Autoclave
JEDEC JESD-22 22-A103-A High Temperature Storage Life
JEDEC JESD-22 22-A104-A Temperature Cycling
JEDEC JESD-22 22-A105-B Power and Temperature Cycling
JEDEC JESD-22 22-A106-A Thermal Shock
JEDEC JESD-22 22-A107-A Salt Atmosphere
JEDEC JESD-22 22-A108-A Bias Life
JEDEC JESD-22 22-A109 Hermeticity
JEDEC JESD-22 22-A110-B Highly-Accelerated Temperature and Humidity Stress Test (HAST)
JEDEC JESD-22 22-A112-A Moisture-Induced Stress Sensitivity for Plastic Surface Mount Devices
JEDEC JESD-22 22-A113-B Preconditioning of Nonhermetic Surface Mount Devices prior to Reliability Testing
JEDEC JESD-22 22-A114-A Electrostatic Discharge (ESD) Sensitivity Testing, Human Body Model (HBM)
JEDEC JESD-22 22-A115-A Electrostatic Discharge (ESD) Sensitivity Testing, Machine Model (MM)
JEDEC JESD-22 22-B100-A Physical Dimensions
JEDEC JESD-22 22-B101 External Visual
JEDEC JESD-22 22-B102-C Solderability
JEDEC JESD-22 22-B103-A Vibration, Variable Frequency
JEDEC JESD-22 22-B104-A Mechanical Shock
JEDEC JESD-22 22-B105-A Lead Integrity
JEDEC JESD-22 22-B106-B Resistance to Soldering Temperature for Through-Hole Mounted Devices
JEDEC JESD-22 22-B107-A Marking Permanency
JEDEC JESD-22 22-B108 Coplanarity Test for Surface-Mount Semiconductor Devices
JEDEC JESD-22 22-C100-A High Temperature Continuity
JEDEC JESD-22 22-C101 Field-Induced Charged-Device Model Test Method for Electrostatic Discharge Withstand Thresholds of Microelectronic Components

Thanks to the University of Maryland CALCE website for the info.

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