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Job Opportunities - Infinera
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Infinera is located in Sunnyvale California. We recently went public on June 13, 2007 and are under the symbol of INFN. We have pioneered the development of the first large scale optical networking system.
Infinera provides Digital Optical Networking systems (the DTN System) to telecommunications carriers, cable operators and other service providers worldwide. Infinera's large-scale photonic integrated circuit (PIC) incorporates 100 Gigabits per second of transmit and receive capacity and the functionality of more than 60 discrete optical components into a pair of indium phosphide chips. Infinera's DTN system and PIC technology are designed to provide optical networks that provide operating simplicity, enhanced revenue generation, faster time-to-service and capital cost savings.
Essential Functions / Key Responsibilities (in order of priority):
Design, analysis and characterization of high-speed (1040 Gb/s), broad-band, mixed-signal, integrated circuits for fiber-based wireline applications.
Position will focus on the design of ICs for fiber-optic modules including laser and modulator drivers, transimpedance, AGC, and limiting amplifiers, multi-channel clock-data-recovery, mux, dmux, and deskew circuits, and dispersion compensation circuits, all at 10-40 Gb/s.
Ability to quickly transition between design, analysis and characterization for high-speed, mixed-signal, and analog circuits is sought.
Education / Experience (required or desired):
MSEE required, PhD EE desired
Knowledge / Skills / Abilities (required or desired):
Experience: MSEE plus five years experience working as an RF and/or mixed-signal IC design engineer, or Ph.D. EE is required. Industry or university experience in optical networking is preferred.
IC Designs: Experience in as many as possible of the designs below is desired:
a. 10 40 Gb/s: Laser and modulator drivers, transimpedance, AGC, and limiting amplifiers, and dispersion compensation circuits.
b. 10 - 40 Gb/s: Multi-channel clock-data-recovery, mux, dmux, and deskew circuits.
c. Low speed analog and mixed signal circuits: opamps, DACs, ADCs.
IC Technologies: High-speed IC technologies. Both SiGe and CMOS experience is desired.
IC Design Software: Experience with analog, digital, and mixed-signal IC design software (e.g. Cadence Composer, Cadence Virtuoso, Cadence Spectre-RF, Verilog-A, Verilog, Virtuoso AMS, Skill language, Agilent ADS, ) is required. Willingness to participate in development and support of common design flow used by all members of design group is required.
System: Understanding of electrical effects due to packaging, and lumped and distributed electrical effects due to circuit board is desired.
Test: Experience with IC testing and IC design that facilitates test is desired. Familiarity with high-speed probe testing and packaged IC testing is also desired.
Laboratory: Experience testing and characterizing high-speed ICs is required. Familiarity with high-speed IC test equipment (RF spectrum analyzer, high-speed oscilloscope, RF network analyzer, RF wafer prober, ) is required. Familiarity with optical communication test equipment (BERT equipment, digital communication analyzers, light-wave component analyzer ) is also desired.
Work Environment: Candidate must be comfortable working in a fast-paced, start up environment. Candidate must be strong individual contributor, and also able to work as member of a small team.
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