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Sr. Engineering Manager
IC Interconnect is a leading supplier of flip chip wafer bumping, wafer level CSP and back-end services to the
semiconductor and electronics communities. Our customers have world wide locations and are serviced from our
manufacturing locations in Colorado Springs. We offer a company supported medical plan, paid holidays, vacation
time, etc.
IC Interconnect is seeking an experienced engineer to do development and manufacturing support in a high tech,
high volume, small company environment on processes to support advanced packaging of wafer and die level bare silicon
products.
Minimum Qualifications:
The minimum educational requirement is BSME or BSM. A proven track record with 10 years experience in electronic
packaging, ISO/TS qualified manufacturing environment. You must have exceptional written and verbal communications
skills, a strong working knowledge of PC's, CAD, SPC and the Microsoft office suite. You must be self reliant
and able to work as part of a team, with a dedication to exceed customer expectations.
Job Description:
This position is ideal for a hands-on, mechanically inclined individual experienced in semiconductor manufacturing
process, die level test, tape and reel, surface mount package construction processes, wafer bumping, WLCSP, plastic
packaging and SMT. In addition, this position will manage the manufacturing operations including process documentation,
programming, SPC and troubleshooting. As a value added service provider we become an integral part of system
reliability. Attention to detail is a must. This career choice offers a challenging and varied work environment.
You will be a key player in the organization, shaping our success by ensuring the efficient operation of our current
processes and developing new capabilities. In this small company you will have a major impact on the success
of projects and the company as a whole. The scope of opportunities for new responsibilities are professional
growth are not constrained as the might be in a larger organization. This position will include:
- Design
- CAD (AutoCAD, GDSII, Artworks, Gerber, Visio)
- SPC (JMP, Minitab, SAS)
- Development
- Process development
- Equipment adaptation for a wide variety of needs.
- Manufacturing
- Equipment programming, Process development and improvement, Cost reduction, Statistical
process control, Equipment PM and Trouble shooting
- Sales
- Driving revenue growth by evaluation of potential new customer applications.
Work Site:
Colorado Springs, Colorado.
Travel:
Occasional travel to provide customer or sales support, conferences and trade shows is required.
Status:
Full time, exempt, must be able to support 24/7 operation.
Compensation:
The compensation structure of a base salary and a quarterly bonus based on company profitability provides security
with a significant upside potential. In addition we offer:
- A company supported medical and dental insurance plan
- Company paid holidays, floating personal days, and vacation
Contact:
IC Interconnect 1025 Elkton Drive Colorado Springs, CO 80907 USA Email:
icinterconnectCO@gmail.com
Website: www.icinterconnect.com
Posted June 16, 2014
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