May 15, 2012 Press Release
Software Demos in Booth #1514 Include AWR 2011 Product Portfolio, Analyst™ 3D FEM EM Debut; AWR and Partners
MicroApps; and Annual Customer Party
EL SEGUNDO, Calif. – May 15, 2012 –
AWR Corporation, the innovation leader in high-frequency EDA
software, once again takes a leadership position at the International Microwave Symposium (IMS) 2012 with a full
slate of AWR 2011 software demonstrations, MicroApps
presentations and panel, and its renowned Customer Appreciation Party.
IMS 2012 takes place from June 17 to 22
in Montréal, Canada.
Visit AWR at Booth #1514 to see Analyst 2012,
AWR’s 3D FEM EM technology for bumps, bond wires, tapered vias and more, as well as the latest release of
Microwave Office™, Visual System Simulator™ (VSS), AXIEM® and Analog Office® for MMIC, RFIC, RF PCBs and module
design.
AWR software demonstrations:
• Analyst 2012 debut:
– 3D FEM EM for bond wires, bumps,
balls, ribbons, tapered vias, finite dielectrics
• AWR 2011 product line including recent additions of:
– VSS and LabVIEW co-simulation for signal processing, hardware in the loop, and communications
standards like LTE and 802.11ac
– VSS’s Radar Library, Frequency Planner and more
– Microwave Office/AXIEM and CapeSym for electrical-thermal MMIC co-simulation
– Microwave
Office/AXIEM for PCB verification via ODB++
– AXIEM’s 3D antenna plots
AWR and its partners will be presenting 11 MicroApps and participating on a panel at the MicroApps Theater (Booth
#1223). These talks provide additional insight into novel applications for and technologies within AWR software.
MicroApps schedule:
Tuesday, June 19:
12:50 p.m. Fully Integrating 3D Electromagnetic (EM)
Simulation into Circuit Simulation
Wednesday, June 20:
9:05 a.m. RF Link Prediction - A New and Novel Approach
10:50 a.m. Linking
RF Design through to Test
12:05 p.m. Panel Session: Device Characterization Methods
and Advanced RF/Microwave Design - webcast and
registration details are available at
http://goo.gl/x2RNw
3:30 p.m. RF System Design -- Moving
Beyond a Linear
Datasheet
3:35 p.m. Improve Microwave Circuit Design Flow through
Passive Model Yield and Sensitivity Analysis
4:35 p.m. Electrical/Thermal Coupled Solutions for Flip Chip
Designs
4:50 p.m. System Simulation Featuring Signal Processing Blocks
Thursday, June 21:
11:20 a.m. Optimizing the Design and Verification of 4G RF Power Amplifiers
11:35 a.m. Simulating an NXP Doherty Power Amplifier with Digital Pre-Distortion
12:50 p.m. Practical
Electromagnetic Modeling of Parallel Plate Capacitors at High Frequency
1:20 p.m. Use of FPGAs for Faster
Test Times and Repeatability on Cellular Measurements
1:50 p.m. Mind Your Reference Plane
Lastly, AWR’s 8th Annual Customer Appreciation Party (Petite Fête d’AWR 2012) is set for Wednesday, June 20 from 7:00
p.m. to midnight at the Pub St. Paul in Old Towne Montréal. Register for this not-to-be-missed event at
http://www.awr-petitefete.com/
About AWR
AWR, the innovation leader in high-frequency EDA software, dramatically reduces development time and cost for
products employed in wireless, high-speed wired, broadband, aerospace and defense, and electro-optical
applications.
Visit AWR at: AWR.TV,
AWR Blogs,
RSS,
Facebook,
Twitter,
YouTube, and
LinkedIn
© Copyright 2012 AWR Corporation. All rights reserved. AWR is a National Instruments
Company. AWR, the AWR logo, AXIEM and Analog Office are registered trademarks and Microwave Office, Visual System
Simulator and iMatch are trademarks of AWR Corporation. Other product and company names listed are trademarks or
trade names of their respective companies.
Contacts:
Sherry Hess
Vice President of Marketing
AWR Corporation
(310) 726-3000
hess@awrcorp.com
Posted 5/15/2012
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