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October 5, 2016
 Skyworks has
broadened its antenna tuner portfolio with two new Mobile Industry Processor Interface (MIPI®)-controlled
devices that support ultra-low Ron (SKY19247-686LF)
and ultra-high Vpeak (SKY19237-001). These new tuners are ideal for smartphones, data cards and MiFi®
hotspots and improve antenna efficiency, as well as Total Radiated Power (TRP) and Total Isotropic Sensitivity
(TIS) performance. They deliver high linearity for carrier aggregation applications and low insertion
loss. These antenna tuners also eliminate concern over GPIO count and efficiently meet the demands of
programmable, complex RF front-end devices. They boast excellent harmonic performance, enabling robust
designs that can pass regulatory certification. The devices come in a compact 10-pin, 1.5 x 1.1 x 0.5
mm QFN package (SKY19247-686LF) and 11-bump, 1.685 × 1.775 × 0.5 mm WLCSP package (SKY19237-001).
Using in-house antenna expertise, Skyworks supports customer implementation with modeling simulation
data, design and layout optimization, as well as onsite support. For more information on this new family,
please visit:
Antenna Tuning for Cellular/Smartphone Applications.
- Broadband frequency range: 0.7 to 2.7 GHz
- Two RF shunts to ground:
- Low RON: 2Ω
- Low COFF: 200 fF
- RF voltage handling in the OFF state: 80 V peak
- High linearity for carrier aggregation applications
- Supply voltage: 2.4 to 4.8 V
- Ultra-small WLCSP (11-bump, 1.685 × 1.775 × 0.5 mm, 262 μm diameter, 400 μm pitch) package (MSL1,
260 °C per JEDEC J-STD-020)
The SKY19237-001
is a wafer level chip scale package (WLCSP) triple-shunt, single-pole, single-throw (3xSPST) switch
with integrated logic and bias block. Both paths are connected on one side to a single RF ground bump.
The part is designed to sustain a peak voltage of 80 V typical without going to breakdown. The switching
is controlled by an integrated Mobile Industry Processor Interface (MIPI) decoder. The SKY19237-001
is provided in a compact 11-bump, 1.685 × 1.775 × 0.5 mm WLCSP that meets requirements for board-level
assembly. Bump diameters are 262 μm, with a minimum bump pitch of 400 μm.
About Skyworks
Skyworks Solutions, Inc. is empowering the wireless networking revolution. Our highly innovative
analog semiconductors are connecting people, places and things spanning a number of new and previously
unimagined applications within the automotive, broadband, cellular infrastructure, connected home, industrial,
medical, military, smartphone, tablet and wearable markets.
Headquartered in Woburn, Massachusetts, Skyworks is a global company with engineering, marketing,
operations, sales, and service facilities located throughout Asia, Europe and North America. For more
information, please visit Skyworks' website at:
www.skyworksinc.com.
Contact
Tami Stegmaier
Sr. Mgr. Corporate Communications
Skyworks Solutions, Inc. (SWKS)
5221 California
Ave
Irvine, CA 92617
Phone: 949-231-4207
E-Mail:
Tami.Stegmaier@skyworksinc.com
Posted November 7, 2016
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