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Enabling compact, high-performance designs for modern electronics
March 18, 2026 - San Mateo, California - Since 2005, San Francisco Circuits has
been a trusted U.S. provider of advanced PCB manufacturing and assembly solutions
for R&D innovators, prime contractors, and integration experts.
Double-Sided
Ball Grid Array (BGA) assembly allows designers to maximize component density
without increasing the board size. From smartphones and IoT devices to medical and
industrial electronics, this approach delivers higher pin counts in a smaller footprint.
BGA technology replaces traditional pins with solder balls under the package, and
placing BGAs on both sides of the PCB increases the usable area, letting engineers
create more compact and complex designs.
Using both sides of the board significantly improves space efficiency. Compared
to single-sided layouts, component density can increase up to 50 percent without
enlarging the PCB. This capability is especially valuable for devices where miniaturization
and performance must go hand in hand.
Assembly requires careful coordination. Solder paste is applied and inspected
to ensure uniform coverage, components are positioned with high-precision pick-and-place
machines, and reflow soldering secures each component. Automated optical inspection
and x-ray imaging verify hidden solder joints, while the second side undergoes the
same process, with additional attention to heavier components to prevent displacement
or thermal stress.
Double-sided BGA assembly also brings technical challenges. Multiple reflow cycles
can create thermal stress and warpage, overlapping components can complicate inspection,
and access for rework is limited. Best practices include using high-Tg substrates,
sequencing lighter BGAs on the bottom, optimizing reflow profiles, and performing
thorough testing to ensure reliability.
By combining thoughtful design with precise assembly processes, double-sided
BGA boards support high-density, high-performance electronics without compromising
reliability.
Read more about
double-sided
BGA assembly on San Francisco Circuits’ website.
About San Francisco Circuits
San Francisco Circuits is a provider of PCB fabrication and assembly, has a dedicated
team specializing in simple and complex PCB fabrication and assembly technologies.
They can produce elaborate and high-quality PCBs in a number of custom and common
layouts. From basic to intricate PCBs–their engineers will meet your PCB fabrication &
assembly needs. The company provides a rare balance between technical expertise
and competitive pricing. And they not only provide high-quality products but also
high-quality customer service at the same time. San Francisco Circuits has been
voted by National Television as the "world's greatest in PCBs" and has demonstrated
experience as a power player in PCB fabrication and assembly.
If you are looking to discuss PCB projects of any size or scope, feel free to
reach out to them via our website (see below).
Contact
Victor Bilandzic
San Francisco Circuits, Inc.
Phone: 1-800-732-5143
Web: www.sfcircuits.com
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