Double-Sided BGA Assembly: High-Density PCBs Without Bigger Boards
San Francisco Circuits

Press Release Archives:

2026 | 2025 | 2024 | 2023
| 2022 | 2021

Content is copyright of company represented. Page format, custom text and images are RF Cafe copyright - do not distribute. Note: Posting of press releases costs $100 each for non-advertisers.

Enabling compact, high-performance designs for modern electronics 

March 18, 2026 - San Mateo, California - Since 2005, San Francisco Circuits has been a trusted U.S. provider of advanced PCB manufacturing and assembly solutions for R&D innovators, prime contractors, and integration experts.

Double-Sided Ball Grid Array (BGA) assembly allows designers to maximize component density without increasing the board size. From smartphones and IoT devices to medical and industrial electronics, this approach delivers higher pin counts in a smaller footprint. BGA technology replaces traditional pins with solder balls under the package, and placing BGAs on both sides of the PCB increases the usable area, letting engineers create more compact and complex designs.

Using both sides of the board significantly improves space efficiency. Compared to single-sided layouts, component density can increase up to 50 percent without enlarging the PCB. This capability is especially valuable for devices where miniaturization and performance must go hand in hand.

Assembly requires careful coordination. Solder paste is applied and inspected to ensure uniform coverage, components are positioned with high-precision pick-and-place machines, and reflow soldering secures each component. Automated optical inspection and x-ray imaging verify hidden solder joints, while the second side undergoes the same process, with additional attention to heavier components to prevent displacement or thermal stress.

Double-sided BGA assembly also brings technical challenges. Multiple reflow cycles can create thermal stress and warpage, overlapping components can complicate inspection, and access for rework is limited. Best practices include using high-Tg substrates, sequencing lighter BGAs on the bottom, optimizing reflow profiles, and performing thorough testing to ensure reliability.

By combining thoughtful design with precise assembly processes, double-sided BGA boards support high-density, high-performance electronics without compromising reliability.

Read more about double-sided BGA assembly on San Francisco Circuits’ website.

About San Francisco Circuits

San Francisco Circuits is a provider of PCB fabrication and assembly, has a dedicated team specializing in simple and complex PCB fabrication and assembly technologies. They can produce elaborate and high-quality PCBs in a number of custom and common layouts. From basic to intricate PCBs–their engineers will meet your PCB fabrication & assembly needs. The company provides a rare balance between technical expertise and competitive pricing. And they not only provide high-quality products but also high-quality customer service at the same time. San Francisco Circuits has been voted by National Television as the "world's greatest in PCBs" and has demonstrated experience as a power player in PCB fabrication and assembly.

If you are looking to discuss PCB projects of any size or scope, feel free to reach out to them via our website (see below).

Contact

Victor Bilandzic
San Francisco Circuits, Inc.
Phone: 1-800-732-5143

Web:  www.sfcircuits.com