Electronics World articles Popular Electronics articles QST articles Radio & TV News articles Radio-Craft articles Radio-Electronics articles Short Wave Craft articles Wireless World articles Google Search of RF Cafe website Sitemap Electronics Equations Mathematics Equations Equations physics Manufacturers & distributors Engineer Jobs LinkedIn Crosswords Engineering Humor Kirt's Cogitations RF Engineering Quizzes Notable Quotes Calculators Education Engineering Magazine Articles Engineering software RF Cafe Archives RF Cascade Workbook 2018 RF Symbols for Visio - Word Advertising Magazine Sponsor RF Cafe RF Electronics Symbols for Visio RF Electronics Symbols for Office Word RF Electronics Stencils for Visio Sponsor Links Saturday Evening Post NEETS EW Radar Handbook Microwave Museum About RF Cafe Aegis Power Systems Anritsu Alliance Test Equipment Amplifier Solutions Anatech Electronics Axiom Test Equipment Berkeley Nucleonics Centric RF Conduct RF Copper Mountain Technologies Empower RF everything RF Exodus Advanced Communications Innovative Power Products ISOTEC KR Filters Lotus Systems PCB Directory Rigol San Francisco Circuits Reactel RFCT TotalTemp Technologies Triad RF Systems Windfreak Technologies Withwave LadyBug Technologies Wireless Telecom Group Sponsorship Rates RF Cafe Software Resources Vintage Magazines Thank you for visiting RF Cafe!
Berkeley Nucleonics Vector Signal Generators Radar Simulations - RF Cafe

Gold and Aluminum Bond Wire Properties
Ultrasonic & Wedge Bonding

Gold wire bonding is a popular technique in the integrated circuit (IC) industry due to its reliability, durability, and low resistance. The technique is commonly used to create interconnects between components such as transistors, capacitors, and resistors, as well as to connect ICs to their packaging. See table of bonding wire properties below.

Thermosonic Wire Bonding is a process used in the manufacturing of integrated circuits (ICs) to create interconnections between the different components of the IC. This technique involves the use of heat and ultrasonic vibrations to bond a thin wire made of gold or aluminum to the components of the IC.

The process of thermosonic wire bonding typically involves several steps. First, a thin wire is fed through a machine that guides it to the correct location on the IC. The wire is then heated using a combination of high-frequency ultrasonic vibrations and thermal energy, which softens the wire and causes it to bond to the components of the IC.

One of the advantages of thermosonic wire bonding is that it can create very strong and reliable bonds between the wire and the components of the IC. This is because the ultrasonic vibrations used in the bonding process help to break down any oxides or contaminants on the surface of the components, allowing the wire to form a strong bond.

In addition, thermosonic wire bonding can be used with a wide range of materials, making it a versatile bonding technique for IC manufacturers. The technique can also be used to create interconnects between components with very small feature sizes, which is important for high-density ICs.

However, like all bonding techniques, thermosonic wire bonding does have some limitations. For example, the process can be time-consuming, as each wire must be bonded individually. In addition, the heat and ultrasonic energy used in the bonding process can potentially damage the components of the IC if not carefully controlled.

Wedge Wire Bonding is a process used in the manufacturing of integrated circuits (ICs) to create interconnections between the different components of the IC. This technique involves the use of a wedge-shaped tool to bond a thin wire made of gold or aluminum to the components of the IC.

The process of wedge wire bonding typically involves several steps. First, a thin wire is fed through a machine that creates a wedge-shaped tool. The tool is then brought into contact with the components of the IC, and pressure is applied to bond the wire to the components.

One of the advantages of wedge wire bonding is that it can create strong and reliable bonds between the wire and the components of the IC. This is because the wedge-shaped tool allows for precise control of the bonding force and placement of the wire.

In addition, wedge wire bonding can be used with a wide range of materials, making it a versatile bonding technique for IC manufacturers. The technique can also be used to create interconnects between components with very small feature sizes, which is important for high-density ICs.

However, like all bonding techniques, wedge wire bonding does have some limitations. For example, it can be more difficult to control the quality of the bonds with this technique compared to other bonding techniques such as thermosonic bonding. In addition, the size and shape of the wedge tool can limit the accessibility to certain components, especially in complex IC designs.

Here is an article which gives equations for calculating fusing current when the duty cycle is very small, "Bond Wire Fusing in ICs with Pulsed Current." Note that much larger currents can be handled with very short pulses. Here is the whitepaper for the formula.

This paper by Sandia National Laboratories is titled, "1 Mil Gold Bond Wire Study."

These values (for a constant current) are typical for standard industry bond wire, and could vary from one product to another.
Wire Type Diameter
(mils)
Wire Area
(mils2)
Resistivity
(Ω/inch)
Typical DC
Fusing Current
(amps)
Recommended
Bond Pad Size
(mils)
Gold 1.00 0.79 1.16 0.6-0.7 4 x 4
1.30 1.33 0.693 0.9-1.0 5 x 5
1.50 1.77 0.521 1.2-1.4 6 x 6
2.00 3.14 0.294 1.6-2.0 8 x 8
Aluminum 1.00 0.79 1.33 0.27-0.30 3.5 x 3.5
1.25 1.23 0.856 0.4-0.5 4 x 4
1.50 1.77 0.595 0.6-0.7 6 x 6
2.00 3.14 0.335 1.0-1.2 6 x 8
3.00 7.07 0.149 2-2.5 9 x 12
4.00 12.57 0.0838 3.5-4.0 12 x 20
5.00 19.63 0.0537 5-6 15 x 25
8.00 50.27 0.0210 11-12 20 x 32
10.00 78.54 0.0134 16-18 25 x 40
12.00 113.10 0.0093 21-23 30 x 48
15.00 176.71 0.0059 20-35 40 x 60
20.00 314.16 0.0033 50-60 50 x 80

99.99% purity @ 20°C

 

 

Posted March 15, 2023
(updated from original post on 2/13/2009)

RF Cascade Workbook 2018 - RF Cafe

Rigol DSG5000 Microwave Generator - RF Cafe
PCB Directory (Manufacturers)
Innovative Power Products Passive RF Products - RF Cafe

Please Support RF Cafe by purchasing my  ridiculously low−priced products, all of which I created.

These Are Available for Free

 

About RF Cafe

Kirt Blattenberger - RF Cafe Webmaster

Copyright: 1996 - 2024

Webmaster:

    Kirt Blattenberger,

    BSEE - KB3UON

RF Cafe began life in 1996 as "RF Tools" in an AOL screen name web space totaling 2 MB. Its primary purpose was to provide me with ready access to commonly needed formulas and reference material while performing my work as an RF system and circuit design engineer. The World Wide Web (Internet) was largely an unknown entity at the time and bandwidth was a scarce commodity. Dial-up modems blazed along at 14.4 kbps while tying up your telephone line, and a nice lady's voice announced "You've Got Mail" when a new message arrived...

All trademarks, copyrights, patents, and other rights of ownership to images and text used on the RF Cafe website are hereby acknowledged.

My Hobby Website:

AirplanesAndRockets.com