Please support my efforts by advertising!
Serving a Pleasant Blend of Yesterday, Today, and Tomorrow™
Vintage Magazines
Electronics World
Popular Electronics
Radio & TV News
QST | Pop Science
Popular Mechanics
Radio-Craft
Radio-Electronics
Short Wave Craft
Electronics | OFA
Saturday Eve Post
Please Support My Advertisers!

Formulas & Data

Electronics | RF
Mathematics
Mechanics | Physics


About | Sitemap
Homepage Archive

Resources

Articles, Forums Calculators, Radar
Magazines, Museum
Radio Service Data
Software, Videos

Entertainment

Crosswords, Humor Cogitations, Podcast
Quotes, Quizzes

Parts & Services

1000s of Listings

   Software: RF Cascade Workbook | Espresso Engineering Workbook | Cafe Press
RF Stencils for Visio | RF Symbols for Visio | RF Symbols for Office
Aegis Power | Alliance Test | Centric RF | Empower RF | ISOTEC | Reactel | RFCT | San Fran Circuits
Innovative Power Products (IPP) RF Combiners / Dividers

IC Package Outlines

Click on the image of the package family of interest for dimensioned drawings of common pin counts.

For detailed PCB layout drawings click here to go to the Semiconductor Vendor Links page on RF Cafe. See table of package information at bottom of page.

DIP

(Dual Inline Package)

SOIC

(Small Outline Integrated Circuit)

DIP package drawing - RF Cafe SOIC package drawing - RF Cafe
PLCC

(Plastic Leaded Chip Carrier)

LCC
PLCC package drawing - RF Cafe LCC  package drawing - RF Cafe
TO

(Transistor Outline)

TSSOP

(Thin Shrink Small Outline Package)

TO package drawing - RF Cafe  TO package drawing - RF Cafe TSSOP package drawing - RF Cafe
SOT

(Small Outline Transistor)

SSOP

(Shrink Small Outline Package)

SOT package drawing - RF Cafe  

Small Package Designations

Designation Package
DIP Dual inline package
MSOP Micro SOP
PDIP Plastic DIP
QSOP Quarter SOP
SIP Single inline package
SOIC (or SO) Small-outline IC
SOJ J-lead SOP
SOP Small-outline package
SOT Small-outline transistor
SSOP Shrink SOP
TSOP Thin SOP
TSSOP Thin shrink SOP
TVSOP Thin very fine SOP
Note: These designations are often followed by numbers that indicate the number of leads.

Small Package Dimensions
Package designation

and pin count

Nominal body size

(L3W3H) (mm)

Total footprint

(L3W) (mm)

Lead pitch

(mm)

DIP-8 10×6×5 5×7.5 2.54 (0.1 in.)
SO-8 5×4×1.75 5×6 1.27 (0.05 in.)
SSOP-8 3×5.3×2 3×8 0.65
TSSOP-8 3×4.4×1.2 3×6.4 0.65
MSOP-8 3×3×1.1 3×5 0.65
TVSOP-14 3.6×4.4×1.2 3×6.4 0.4
QSOP-16 4.9×3.9×1.7 4.9×6 0.635 (0.025 in.)
SOT23-5 3×1.6×1 3×3 0.95
Innovative Power Products (IPP) RF Combiners / Dividers
LadyBug RF Power Sensors



Innovative Power Products Cool Chip Thermal Dissipation - RF Cafe