December 13, 1965 Electronics
[Table of Contents]
Wax nostalgic about and learn from the history of early electronics.
See articles from Electronics,
published 1930 - 1988. All copyrights hereby acknowledged.
Maybe at one time I knew this,
but the claim by Fairchild Semiconductor in this 1965 Electronics magazine advertisement
took me by surprise. They claim to have invented the dual-inline-package (DIP) format.
According to Wikipedia, a trio of chaps - Don Forbes, Rex Rice and Bryant Rogers - all
Fairchild engineers, developed the DIP package in 1964, a year prior to the ad.
Previously, a round can designated TO# (Transistor Outline) with # (number) leads
around the perimeter was used for integrated circuits, but as the I/O pin count
increased, that form factor became unwieldy. An extensive search for a patent on the
DIP, assigned to Fairchild and/or the three inventors, did not turn up anything. If
you happen to know of a patent number, please send me an e-mail.
Fairchild Semiconductor Ad
Fairchild invented Dual in-line packaging for
manufacturers of commercial equipment. Dual in-line is a little larger than military-aerospace
It is also a lot easier to work with. (Insert it by hand or by machine.) Its leads
have (Dual in-line actual size.) dimensional tolerances to fit holes drilled to
commercial standards. Use standard circuit boards. Flow solder it. In fact, handle it
the way you would any discrete component.
Dual in-line saves you trouble in the field, too: it has an all-ceramic body to prevent
accidental shorts. Leads can be probed from the top, where they are visible to the serviceman.
And, should you ever have to replace a circuit, a pair of pliers and a soldering iron
are all the equipment you need. We have a complete line of logic functions available
in Dual in-line. Your distributor has them in stock. Or, write for brochure.
Fairchild Semiconductor / A Division of Fairchild Camera Instrument Corporation, 313
Mountain View, California (415) 962-5011 TWX: 910-379-6435
Posted August 16, 2018