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Bittele Electronics' selective soldering process uses a fountain
of molten solder to pinpoint individual leads.
December 2, 2019 - Bittele Electronics, with facilities in Canada, The United
States, and China, has an ability to perform "selective soldering" on through-hole mounted
components to target individual pins as opposed to exposing the entire PCB to a
wave soldering process. As described on the Bittele website, selective soldering
is used on assemblies where through-hole components are distributed across the PCB,
as opposed to a high density connector pin array where applying a single blob of
solder (using a "fountain" stream - see image to the right) would be difficult.
In some instances both wave soldering and selective soldering is used. Since the
vast majority of printed circuit assemblies use surface mounted components, selective
soldering and/or wave soldering is performed first for through-hole component, and
then surface mount components are added and a solder reflow pass bonds them to the
PCB. Selective soldering allows through-hole components to be safely soldered even
after the reflow process has been completed. Read more on the "Bittele's Selective Soldering Capabilities"
In business since 2003, Bittele Electronics Inc. has established itself as a
Turn-Key PCB assembly company for prototype and low-to-mid volume PCB fabrication
and assembly services. Our facility in Toronto, Canada incorporates our Head Office,
Sales Office, Parts Procurement Team, as well as our State-of-the-Art PCB Assembly
line. This allows us to offer our customers low-cost, One-stop PCB Assembly Services,
including PCB fabrication, parts procurement and PCB Assembly. Our customers are
primarily in the United States and Canada, in a wide variety of industries. Production
All the facilities of IPC-member Bittele Electronics are ISO9001 certified and
IPC-A-600 & IPC-A-610 compliant.
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