Opening day of the conference features in-depth
training with three-hour short courses on RF, microwave, and high-speed digital design.
Norwood, Mass., June 21, 2017 - The Electronic Design Innovation Conference and Exhibition
(EDI CON) USA, the first industry event to bring together RF/microwave and high-speed digital
design engineers and system integrators, announced today the addition of a full day of training
to its conference program at the Hynes Convention Center, September 11-13 in Boston, MA.
Organizers of EDI CON have invited industry experts to teach
3-hour short courses
on relevant topics necessary for success in today's high-speed and high-frequency designs.
The day also includes sponsored 3-hour training sessions from industry-leading companies.
In addition to access to instructors who are preeminent in their respective fields, attendees
will be treated to a lunch, networking breaks, and an afternoon reception courtesy of the
day's sponsors: Mentor Graphics Corporation, a Siemens business; Teledyne LeCroy; Rohde &
Schwarz; and Analog Devices.
Scheduled short courses include:
| • |
 Practical Antenna Design for Wireless Products, presented
by Henry Lau, Lexiwave Technology, Inc. |
| • |
 Radar, Phased-Arrays, Metamaterials
and MIMO – Basics, Advances And Breakthroughs, presented by Dr. Eli Brookner, Retired, Raytheon |
| • |
 Power Integrity 101, presented
by Steve Sandler, Founder, Picotest |
| • |
 Transferring Board
Design into PCB Design: Get it Right the First Time, presented by Shalom Shlomi Zigdon, iTech
iCollege Israel |
| • |
 Five Steps to Engineer Transparent Vias in High-Speed Circuit
Boards, presented by Eric Bogatin, Editor Signal Integrity Journal & Dean of Signal Integrity
Academy; Sponsored by Mentor Graphics, a Siemens Company |
| |
Practical Board Level Power Integrity Measurement and Design
Principles, presented by Eric Bogatin, Editor Signal Integrity Journal & Dean of Signal
Integrity Academy; Sponsored by Teledyne LeCroy |
| • |
 RF & Bench Essentials
for IoT Device Debugging, presented by Greg Bonaguide; Sponsored by Rohde & Schwarz
|
Attendees will require a conference pass to attend these sessions.
More information on the short
courses and their abstracts can be found here.
EDI CON USA 2017 is building on its inaugural 2016 conference with multiple parallel tracks
covering RF/microwave, high-speed digital and EMC/EMI topics. The conference features these
extended short courses on Monday, September 11 followed by technical sessions, invited talks,
workshops, panels and exhibition on Tuesday and Wednesday. Technical sessions focus on actionable,
educational information for working engineers rather than product pitches and commercial presentations.
This year, EDI CON USA is the biggest RF/microwave industry conference and exhibition in
the continental USA, and the largest high-speed technical conference on the US East Coast.
Networking opportunities will abound on the exhibit floor, and attendees can enjoy a welcome
reception and happy hour. More information, including registration and how to exhibit, is
available at www.ediconusa.com. EDI
CON USA 2017 is supported by its primary media sponsors, Microwave Journal and Signal Integrity Journal. For
future planning, EDI CON USA 2018 will be held at the Santa Clara Convention Center (Santa
Clara, CA) October 17-19, 2018.
About EDI CON USA
EDI CON USA uniquely brings together RF, microwave, EMC/EMI, and high-speed digital design
engineers and system integrators for networking, training, and learning opportunities. Attendees
come to EDI CON USA to find solutions, products, and design ideas that they can put into immediate
practice for today's communication, defense, consumer electronics, aerospace, and medical
industries. Drawing attendees from both the analog and digital spheres, EDI CON enables designers
to see techniques and technologies used in other applications that could be applied or adapted
to solve their latest design challenges. The exhibition hall features product displays, demonstrations,
design contests, interactive sessions, speed trainings, networking opportunities, and educational
talks that address all aspects of design, simulation, test, and verification.
www.ediconusa.com
About the Organizers
EDI CON USA is organized by Microwave Journal, the Signal Integrity Journal, and the event
planning division of their parent company, Horizon House. Microwave Journal, Signal Integrity
Journal, and Horizon House also team with Microwave Journal China and ACT International (Hong
Kong) to organize and produce EDI CON China (April 25-27, 2017 in Shanghai, China). An experienced
and well-established organizer of targeted events, Horizon House additionally organizes European
Microwave Week (EuMW) on behalf of the European Microwave Association (EuMA) and the M2M Zone
at CTIA Super Mobility Week/Mobile World Congress Americas. To subscribe to Signal Integrity
Journal, visit www.signalintegrityjournal.com
The EDI CON technical program is developed in collaboration with leading international
technology companies and experts in high-frequency and high-speed electronic design with experience
ranging from modeling and design to component characterization, system integration, and verification.
Event Contact:
Janine Love, Event Director +1-857-350-2216
jlove@horizonhouse.com
Twitter: @tb_janine
Sales Contact:
Carl Sheffres, Publisher +1-781-619-1949 csheffres@mwjournal.com
Editorial Contacts:
NNorth America: Pat Hindle +1 781-619-1946
PHindle@MWJournal.com
Twitter: @pathindle
International: Richard Mumford +44 207 596 8787
RMumford@MWJournal.com
Posted June 23, 2017
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