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fresh out of school or are relatively new to the work world. Come to think of it,
they would make equally excellent study material for the same persons who are going
to be interviewed for a job.
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RF Cafe Quizzes.
Note: Some material based on books have
quoted passages.
This
quiz is based on the information presented in Microwave and Millimeter-Wave Electronic Packaging,
by Rick Sturdivant.
Graciously provided by
Artech House
1. Match the following frequency band ranges with their proper letter
designations.
C K Ka Ku L S UHF V VHF W X |
30 kHz - 300 MHz 300 MHz - 1 GHz 1 GHz - 2 GHz 2 GHz - 4 GHz 4 GHz - 8 GHz
8 GHz - 12 GHz 12 GHz - 18 GHz 18 GHz - 27 GHz 27 GHz - 40 GHz 40 GHz - 75 GHz
75 GHz - 110 GHz |
2. What is the main additional issue concerning high versus
low frequency design?
a) Resonances b) Distributed reactance c)
Cross-coupling d) All the above
3. What is
the difference between loss tangent and dissipation factor?
a) Loss tangent has no
resistance value b) Dissipation factor does not account for permittivity being complex
at high frequencies c) Loss tangent includes resistance d) There is no difference
between the two
4. What is a first-level interconnect
in reference to RFIC design?
a) Electrical connection between the semiconductor device
and the package b) Electrical connection between the first and second level semiconductor
metallization c) Electrical connection from the bottom metallization of the semiconductor
to the heatsink d) Mechanical connection from the bottom metallization of the semiconductor
to the heatsink
5. Match the following terms with their
proper definitions.
Atomic polarization |
Occurs when molecules with ionic bonds have a displacement of the positive ions relative
to negative ions in the presence of an electric field. |
Ionic polarization |
Occurs when the center of an electron cloud of an atom is displaced relative to the center
of the nucleus in the presence of an electric field. |
Orientation polarization |
Occurs when molecules that have a permanent dipole moment, but are naturally randomly
oriented, orient themselves in the presence of an electric field. |
6. What makes metals good electrical conductors?
a) Bound electrons b) Free electrons c) Reciprocal mho effect d)
Free protons
7. What are properties of ceramics that
make them good as microwave circuitry substrates?
a) Inherently stable due to high
Young's modulus b) Low insertion loss for types like alumina and quartz c) Tight
line resolutions for impedance control d) a & b e) a & c f)
b & c g) All the above
8. What type of
thick film pastes are available for use on ceramic substrates?
a) Metals b)
Resistive c) Insulative d) a & b e) a & c f) b &
c g) All the above
9.
What are the names of the two ends of the depicted type of wire
bond?
a) Sphere and plane b) Circle and line c) Ball and wedge
d) Ball and stitch
10. What is one of the main
advantages of flip chip mounting for high frequency ICs?
a) Larger die possible
b) Lower cost c) Lower wire bond inductance d) Higher reliability
Need some help? Click here for the
answers and explanations.
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