Electronics World articles Popular Electronics articles QST articles Radio & TV News articles Radio-Craft articles Radio-Electronics articles Short Wave Craft articles Wireless World articles Google Search of RF Cafe website Sitemap Electronics Equations Mathematics Equations Equations physics Manufacturers & distributors Engineer Jobs LinkedIn Crosswords Engineering Humor Kirt's Cogitations RF Engineering Quizzes Notable Quotes App Notes Calculators Education Engineering magazine articles Engineering software Engineering smorgasbord RF Cafe Archives RF Cascade Workbook 2018 RF Stencils for Visio RF & EE Shapes for Word Advertising RF Cafe Homepage Thank you for visiting RF Cafe!
Exodus Advanced Communications

Microwave and Millimeter-Wave Electronic Packaging
RF Cafe Quiz #58

RF Engineering Quizzes - RF CafeAll RF Cafe Quizzes make great fodder for employment interviews for technicians or engineers - particularly those who are fresh out of school or are relatively new to the work world. Come to think of it, they would make equally excellent study material for the same persons who are going to be interviewed for a job.

Click here for the complete list of RF Cafe Quizzes.

Note: Some material based on books have quoted passages.

 

Microwave and Millimeter-Wave Electronic Packaging - RF CafeThis quiz is based on the information presented in Microwave and Millimeter-Wave Electronic Packaging, by Rick Sturdivant.

Graciously provided by Artech House

 

 

 

 

1.  Match the following frequency band ranges with their proper letter designations.

Letter Frequency Range
C
K
Ka
Ku
L
S
UHF
V
VHF
W
X		 30 kHz - 300 MHz
300 MHz - 1 GHz
1 GHz - 2 GHz
2 GHz - 4 GHz
4 GHz - 8 GHz
8 GHz - 12 GHz
12 GHz - 18 GHz
18 GHz - 27 GHz
27 GHz - 40 GHz
40 GHz - 75 GHz
75 GHz - 110 GHz




2.  What is the main additional issue concerning high versus low frequency design?

a)  Resonances
b)  Distributed reactance
c)  Cross-coupling
d)  All the above




3.  What is the difference between loss tangent and dissipation factor?

a)  Loss tangent has no resistance value
b)  Dissipation factor does not account for permittivity being complex at high frequencies
c)  Loss tangent includes resistance
d)  There is no difference between the two




4.  What is a first-level interconnect in reference to RFIC design?

a)  Electrical connection between the semiconductor device and the package
b)  Electrical connection between the first and second level semiconductor metallization
c)  Electrical connection from the bottom metallization of the semiconductor to the heatsink
d)  Mechanical connection from the bottom metallization of the semiconductor to the heatsink




5.  Match the following terms with their proper definitions.

Term Definition
Atomic polarization Occurs when molecules with ionic bonds have a displacement of the positive ions relative to negative ions in the presence of an electric field.
Ionic polarization Occurs when the center of an electron cloud of an atom is displaced relative to the center of the nucleus in the presence of an electric field.
Orientation polarization Occurs when molecules that have a permanent dipole moment, but are naturally randomly oriented, orient themselves in the presence of an electric field.




6.  What makes metals good electrical conductors?

a)  Bound electrons
b)  Free electrons
c)  Reciprocal mho effect
d)  Free protons




7.  What are properties of ceramics that make them good as microwave circuitry substrates?

a)  Inherently stable due to high Young's modulus
b)  Low insertion loss for types like alumina and quartz
c)  Tight line resolutions for impedance control
d)  a & b
e)  a & c
f)  b & c
g)  All the above




8.  What type of thick film pastes are available for use on ceramic substrates?

a)  Metals
b)  Resistive
c)  Insulative
d)  a & b
e)  a & c
f)  b & c
g)  All the above




Wire bond designations - RF Cafe9.  What are the names of the two ends of the depicted
      type of wire bond?

a)  Sphere and plane
b)  Circle and line
c)  Ball and wedge
d)  Ball and stitch




10.  What is one of the main advantages of flip chip mounting for high frequency ICs?

a)  Larger die possible
b)  Lower cost
c)  Lower wire bond inductance
d)  Higher reliability



Need some help? Click here for the answers and explanations.
Anatech Electronics (RF Filters) - RF Cafe ConductRF Precision RF VNA Test Cables - RF Cafe
Res-Net Microwave - RF Cafe LOTUS Communications Systems Modular RF Component Building Blocks - RF Cafe
About RF Cafe
Kirt Blattenberger - RF Cafe Webmaster
Copyright: 1996 - 2024
Webmaster:
    Kirt Blattenberger,
    BSEE - KB3UON

RF Cafe began life in 1996 as "RF Tools" in an AOL screen name web space totaling 2 MB. Its primary purpose was to provide me with ready access to commonly needed formulas and reference material while performing my work as an RF system and circuit design engineer. The World Wide Web (Internet) was largely an unknown entity at the time and bandwidth was a scarce commodity. Dial-up modems blazed along at 14.4 kbps while typing up your telephone line, and a nice lady's voice announced "You've Got Mail" when a new message arrived...

All trademarks, copyrights, patents, and other rights of ownership to images and text used on the RF Cafe website are hereby acknowledged.

My Hobby Website:  AirplanesAndRockets.com

spacer

Please Support RF Cafe by purchasing my  ridiculously low−priced products, all of which I created.

These Are Available for Free